Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Heat conduction solutions

The standard Galerkin technique provides a flexible and powerful method for the solution of problems in areas such as solid mechanics and heat conduction where the model equations arc of elliptic or parabolic type. It can also be used to develop robust schemes for the solution of the governing equations of... [Pg.53]

Conduct the preparation in the fume cupboard. Dissolve 250 g. of redistilled chloroacetic acid (Section 111,125) in 350 ml. of water contained in a 2 -5 litre round-bottomed flask. Warm the solution to about 50°, neutralise it by the cautious addition of 145 g. of anhydrous sodium carbonate in small portions cool the resulting solution to the laboratory temperature. Dissolve 150 g. of sodium cyanide powder (97-98 per cent. NaCN) in 375 ml. of water at 50-55°, cool to room temperature and add it to the sodium chloroacetate solution mix the solutions rapidly and cool in running water to prevent an appreciable rise in temperature. When all the sodium cyanide solution has been introduced, allow the temperature to rise when it reaches 95°, add 100 ml. of ice water and repeat the addition, if necessary, until the temperature no longer rises (1). Heat the solution on a water bath for an hour in order to complete the reaction. Cool the solution again to room temperature and slowly dis solve 120 g. of solid sodium hydroxide in it. Heat the solution on a water bath for 4 hours. Evolution of ammonia commences at 60-70° and becomes more vigorous as the temperature rises (2). Slowly add a solution of 300 g. of anhydrous calcium chloride in 900 ml. of water at 40° to the hot sodium malonate solution mix the solutions well after each addition. Allow the mixture to stand for 24 hours in order to convert the initial cheese-Uke precipitate of calcium malonate into a coarsely crystalline form. Decant the supernatant solution and wash the solid by decantation four times with 250 ml. portions of cold water. Filter at the pump. [Pg.490]

The experimental conditions for conducting the above reaction in the presence of dimethylformamide as a solvent are as follows. In a 250 ml. three-necked flask, equipped with a reflux condenser and a tantalum wire Hershberg-type stirrer, place 20 g. of o-chloronitrobenzene and 100 ml. of diinethylform-amide (dried over anhydrous calcium sulphate). Heat the solution to reflux and add 20 g. of activated copper bronze in one portion. Heat under reflux for 4 hours, add another 20 g. portion of copper powder, and continue refluxing for a second 4-hour period. Allow to cool, pour the reaction mixture into 2 litres of water, and filter with suction. Extract the solids with three 200 ml. portions of boiling ethanol alternatively, use 300 ml. of ethanol in a Soxhlet apparatus. Isolate the 2 2- dinitrodiphenyl from the alcoholic extracts as described above the 3ueld of product, m.p. 124-125°, is 11 - 5 g. [Pg.528]

The heating of a conductive solution due to the passage of an electric current through the solution. [Pg.601]

In this section we consider the boundary value problem for model equations of a thermoelastic plate with a vertical crack (see Khludnev, 1996d). The unknown functions in the mathematical model under consideration are such quantities as the temperature 9 and the horizontal and vertical displacements W = (w, w ), w of the mid-surface points of the plate. We use the so-called coupled model of thermoelasticity, which implies in particular that we need to solve simultaneously the equations that describe heat conduction and the deformation of the plate. The presence of the crack leads to the fact that the domain of a solution has a nonsmooth boundary. As before, the main feature of the problem as a whole is the existence of a constraint in the form of an inequality imposed on the crack faces. This constraint provides a mutual nonpenetration of the crack faces ... [Pg.198]

Copper, with its high heat conductivity, resists frictional heat during service and is readily moldable. It is generally used as a base metal, at 60—75 wt %, whereas tin or zinc powders are present at 5—10 wt %. Tin and zinc are soluble in the copper, and strengthen the matrix through the formation of a soHd solution during sintering. [Pg.189]

Steady state pi oblems. In such problems the configuration of the system is to be determined. This solution does not change with time but continues indefinitely in the same pattern, hence the name steady state. Typical chemical engineering examples include steady temperature distributions in heat conduction, equilibrium in chemical reactions, and steady diffusion problems. [Pg.425]

When q is zero, Eq. (5-18) reduces to the famihar Laplace equation. The analytical solution of Eq. (10-18) as well as of Laplaces equation is possible for only a few boundary conditions and geometric shapes. Carslaw and Jaeger Conduction of Heat in Solids, Clarendon Press, Oxford, 1959) have presented a large number of analytical solutions of differential equations apphcable to heat-conduction problems. Generally, graphical or numerical finite-difference methods are most frequently used. Other numerical and relaxation methods may be found in the general references in the Introduction. The methods may also be extended to three-dimensional problems. [Pg.556]

Grady and Asay [49] estimate the actual local heating that may occur in shocked 6061-T6 Al. In the work of Hayes and Grady [50], slip planes are assumed to be separated by the characteristic distance d. Plastic deformation in the shock front is assumed to dissipate heat (per unit area) at a constant rate S.QdJt, where AQ is the dissipative component of internal energy change and is the shock risetime. The local slip-band temperature behind the shock front, 7), is obtained as a solution to the heat conduction equation with y as the thermal diffusivity... [Pg.242]

Other cases, neglecting heat effects would cause serious errors. In such cases the mathematical treatment requires the simultaneous solution of the diffusion and heat conductivity equations for the catalyst pores. [Pg.27]

The solute is distributed largely over 4-vn plates in the column and thus, as (n) is large, the differential temperature between plates is negligible, and so the heat conducted axially along the column will be very small compared with that conducted radially to the walls and from the system. [Pg.212]

The general heat-conduction equation, along with the familiar diffusion equation, are both consequences of energy conservation and, like we have just seen for the Navier-Stokes equation, require a first-order approximation to the solution of Boltz-man s equation. [Pg.485]

We have, in this chapter, encountered a number of properties of solids. In Table 5-II, we found that melting points and heats of melting of different solids vary widely. To melt a mole of solid neon requires only 80 calories of heat, whereas a mole of solid copper requires over 3000 calories. Some solids dissolve in water to form conducting solutions (as does sodium chloride), others dissolve in water but no conductivity results (as with sugar). Some solids dissolve in ethyl alcohol but not in water (iodine, for example). Solids also range in appearance. There is little resemblance between a transparent piece of glass and a lustrous piece of aluminum foil, nor between a lump of coal and a clear crystal of sodium chloride. [Pg.80]

A variety of studies can be found in the literature for the solution of the convection heat transfer problem in micro-channels. Some of the analytical methods are very powerful, computationally very fast, and provide highly accurate results. Usually, their application is shown only for those channels and thermal boundary conditions for which solutions already exist, such as circular tube and parallel plates for constant heat flux or constant temperature thermal boundary conditions. The majority of experimental investigations are carried out under other thermal boundary conditions (e.g., experiments in rectangular and trapezoidal channels were conducted with heating only the bottom and/or the top of the channel). These experiments should be compared to solutions obtained for a given channel geometry at the same thermal boundary conditions. Results obtained in devices that are built up from a number of parallel micro-channels should account for heat flux and temperature distribution not only due to heat conduction in the streamwise direction but also conduction across the experimental set-up, and new computational models should be elaborated to compare the measurements with theory. [Pg.187]

Transient Heat Conduction. Our next simulation might be used to model the transient temperature history in a slab of material placed suddenly in a heated press, as is frequently done in lamination processing. This is a classical problem with a well known closed solution it is governed by the much-studied differential equation (3T/3x) - q(3 T/3x ), where here a - (k/pc) is the thermal diffuslvity. This analysis is also identical to transient species diffusion or flow near a suddenly accelerated flat plate, if q is suitably interpreted (6). [Pg.274]

Homogeneous through execution schemes are quite applicable in the cases where the diffusion coefficient is found as an approximate solution of other equations. For instance, such schemes are aimed at solving the equations of gas dynamics in a heat conducting gas when the diffusion coefficient depends on the density and has discontinuities on the shock waves. [Pg.146]

By analogy with the heat conduction equation we employ the method of separation of variables, in the framework of which a solution of this problem is sought as the series... [Pg.349]

The origiiral problem. We begin by placing the first boundary-value problem for for the heat conduction equation in which it is required to find a continuous in the rectangle Dt = 0[Pg.459]

An one-point heat source. Of special interest is the nonstationary heat conduction problem in the situation when a heat source is located only at a single point x = under the agreement that at this point the solution of problem (l)-(3) satisfies the condition of conjugation... [Pg.481]

Some analytical solutions to the quasilinear heat conduction equation. ... [Pg.512]

The second method of special investigations with concern of additive schemes was demonstrated in Section 8 in which convergence in the space C of a locally one-dimensional scheme associated with the heat conduction equation was established by means of this method. Let us stress that in such an analysis we assume, as usual, the existence, uniqueness and a sufficient smoothness of a solution of the original multidimensional problem under consideration. [Pg.623]

The numerical solution of problem (1) by means of iteration schemes can be done using the alternating direction scheme for the heat conduction... [Pg.711]


See other pages where Heat conduction solutions is mentioned: [Pg.94]    [Pg.580]    [Pg.94]    [Pg.580]    [Pg.696]    [Pg.2951]    [Pg.551]    [Pg.774]    [Pg.179]    [Pg.78]    [Pg.187]    [Pg.203]    [Pg.348]    [Pg.378]    [Pg.142]    [Pg.373]    [Pg.148]    [Pg.148]    [Pg.34]    [Pg.72]    [Pg.174]    [Pg.323]    [Pg.514]    [Pg.749]    [Pg.597]    [Pg.182]    [Pg.243]    [Pg.599]   


SEARCH



Conduction heating

Conduction, heat computer solutions

Conduction, heat exact solutions

Conductive heating

Conductive solution

Heat conductance

Heat conduction

Heat conduction approximate solutions

Heat conduction general solution

Heat conductive

Numerical solution of heat conduction

Numerical solution of heat conduction problems

Numerical solutions to heat conduction problems

Solution conductance

Solution conductivity

© 2024 chempedia.info