Grain point defects

Issues associated with order occupy a large area of study for crystalline matter [1, 7, 8]. For nearly perfect crystals, one can have systems with defects such as point defects and extended defects such as dislocations and grain... 

If tlie level(s) associated witli tlie defect are deep, tliey become electron-hole recombination centres. The result is a (sometimes dramatic) reduction in carrier lifetimes. Such an effect is often associated witli tlie presence of transition metal impurities or certain extended defects in tlie material. For example, substitutional Au is used to make fast switches in Si. Many point defects have deep levels in tlie gap, such as vacancies or transition metals. In addition, complexes, precipitates and extended defects are often associated witli recombination centres. The presence of grain boundaries, dislocation tangles and metallic precipitates in poly-Si photovoltaic devices are major factors which reduce tlieir efficiency. 

Fig. 9. Schematic of a two-dimensional cross section of an AgBr emulsion grain showing the surface and formation of various point defects A, processes forming negative kink sites and interstitial silver ions B, positive kink site and C, process forming a silver ion vacancy at a lattice position and positive kink...

The microstmcture and imperfection content of coatings produced by atomistic deposition processes can be varied over a very wide range to produce stmctures and properties similar to or totally different from bulk processed materials. In the latter case, the deposited materials may have high intrinsic stress, high point-defect concentration, extremely fine grain size, oriented microstmcture, metastable phases, incorporated impurities, and macro-and microporosity. AH of these may affect the physical, chemical, and mechanical properties of the coating. 

First, I shall describe the hydrogenation method I used and then consider the passivation of surface states and that of bulk dangling bonds, including grain boundaries, dislocations and point defects. 

It is important that the copper is in the monovalent state and incorporated into the silver hahde crystals as an impurity. Because the Cu+ has the same valence as the Ag+, some Cu+ will replace Ag+ in the AgX crystal, to form a dilute solid solution Cu Agi- X (Fig. 2.6d). The defects in this material are substitutional CuAg point defects and cation Frenkel defects. These crystallites are precipitated in the complete absence of light, after which a finished glass blank will look clear because the silver hahde grains are so small that they do not scatter light. 

Point defects have zero dimension line defects, also known as dislocations, are onedimensional and planar defects such as surface defects and grain boundary defects have two dimensions. These defects may occur individually or in combination. 

In a perfect crystal, all atoms would be on their correct lattice positions in the structure. This situation can only exist at the absolute zero of temperature, 0 K. Above 0 K, defects occur in the structure. These defects may be extended defects such as dislocations. The strength of a material depends very much on the presence (or absence) of extended defects, such as dislocations and grain boundaries, but the discussion of this type of phenomenon lies very much in the realm of materials science and will not be discussed in this book. Defects can also occur at isolated atomic positions these are known as point defects, and can be due to the presence of a foreign atom at a particular site or to a vacancy where normally one would expect an atom. Point defects can have significant effects on the chemical and physical properties of the solid. The beautiful colours of many gemstones are due to impurity atoms in the crystal structure. Ionic solids are able to conduct electricity by a mechanism which is due to the movement of fo/ 5 through vacant ion sites within the lattice. (This is in contrast to the electronic conductivity that we explored in the previous chapter, which depends on the movement of electrons.)... 

The introduction to this chapter mentions that crystals often contain extended defects as well as point defects. The simplest linear defect is a dislocation where there is a fault in the arrangement of the atoms in a line through the crystal lattice. There are many different types of planar defects, most of which we are not able to discuss here either for reasons of space or of complexity, such as grain boundaries, which are of more relevance to materials scientists, and chemical twinning, which can contain unit cells mirrored about the twin plane through the crystal. However,... 

The lattice defects are classified as (i) point defects, such as vacancies, interstitial atoms, substitutional impurity atoms, and interstitial impurity atoms, (ii) line defects, such as edge, screw, and mixed dislocations, and (iii) planar defects, such as stacking faults, twin planes, and grain boundaries. 

The resulting equilibrium concentrations of these point defects (vacancies and interstitials) are the consequence of a compromise between the ordering interaction energy and the entropy contribution of disorder (point defects, in this case). To be sure, the importance of Frenkel s basic work for the further development of solid state kinetics can hardly be overstated. From here on one knew that, in a crystal, the concentration of irregular structure elements (in thermal equilibrium) is a function of state. Therefore the conductivity of an ionic crystal, for example, which is caused by mobile, point defects, is a well defined physical property. However, contributions to the conductivity due to dislocations, grain boundaries, and other non-equilibrium defects can sometimes be quite significant. 

Figure 3-7. Fraction of point defects in a-Ag2S adsorbed on grain boundaries and dislocations as a function of the chemical potential of Ag (T = I68°C).

Let us finally mention that in polycrystalline samples, Nabarro-Herring(-Coble) creep occurs as already introduced in Section 14.3.2. The Nabarro-Herring creep rate is inversely proportional to the square of the average grain size, l2, if volume diffusion of point defects prevails. It is inversely proportional to /3 if grain boundary diffusion determines the transport. 

The driving forces necessary to induce macroscopic fluxes were introduced in Chapter 3 and their connection to microscopic random walks and activated processes was discussed in Chapter 7. However, for diffusion to occur, it is necessary that kinetic mechanisms be available to permit atomic transitions between adjacent locations. These mechanisms are material-dependent. In this chapter, diffusion mechanisms in metallic and ionic crystals are addressed. In crystals that are free of line and planar defects, diffusion mechanisms often involve a point defect, which may be charged in the case of ionic crystals and will interact with electric fields. Additional diffusion mechanisms that occur in crystals with dislocations, free surfaces, and grain boundaries are treated in Chapter 9. 

This process involves creation of additional sites in the crystal. Cation and anion sites must be created in the same proportion as the ratio of cation to anion sites in the host crystal—in this case, 1 1. These defects can also be formed at point-defect sources such as dislocations and grain boundaries (see Sections 11.4 and 13.4). 

R.W. Balluffi. Voids, dislocation loops and grain boundaries as sinks for point defects. In M. T. Robinson and F.W. Young, editors, Proceedings of the Conference on Fundamental Aspects of Radiation Damage in Metals, volume 2, pages 852-874, Springfield, VA, 1975. National Technical Information Service, U.S. Department of Commerce. 

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