Glass transition temperatures resin

Today, most of these problems are being resolved by the use of rigid substrates based on high glass transition temperature resins such as polyimides and modified epoxides. The reduced thermal expansion of these materials at the normal processing or operating temperatures provides for significant increases in dimensional stability compared with GIO or FR4 laminates. 

More recently, Class and Chu" extended the use of dynamic mechanical measurements to a systematic study of resin-elastomer blends which revealed the relationship between the structure, concentration and molecular weight of resins and their effect on the viscoelastic properties of elastomers. Dynamic mechanical data typical of that obtained from an elastomer or elastomer-resin blend is shown in Fig. 4. G is the elastic or storage modulus, G" is the viscous or loss modulus, and the ratio of G jG gives the tan 6 curve. The temperature at which the tan 6 curve shows a maximum corresponds to a dynamic glass transition temperature. Class and Chu showed that with these types of measurements, the effect of modifying resins on the viscoelastic properties of elastomers can be readily determined. Resins which are compatible with an elastomer will cause a decrease in the elastic modulus G at room temperature and an increase in the tan delta peak or glass transition temperature. Resins which are incompatible with an elastomer will cause an increase in the elastic modulus G at room temperature and will show two distinct maxima in the tan delta curve. 

Elastomeric Modified Adhesives. The major characteristic of the resins discussed above is that after cure, or after polymerization, they are extremely brittie. Thus, the utility of unmodified common resins as stmctural adhesives would be very limited. Eor highly cross-linked resin systems to be usehil stmctural adhesives, they have to be modified to ensure fracture resistance. Modification can be effected by the addition of an elastomer which is soluble within the cross-linked resin. Modification of a cross-linked resin in this fashion generally decreases the glass-transition temperature but increases the resin dexibiUty, and thus increases the fracture resistance of the cured adhesive. Recendy, stmctural adhesives have been modified by elastomers which are soluble within the uncured stmctural adhesive, but then phase separate during the cure to form a two-phase system. The matrix properties are mosdy retained the glass-transition temperature is only moderately affected by the presence of the elastomer, yet the fracture resistance is substantially improved. 

This type of adhesive is generally useful in the temperature range where the material is either leathery or mbbery, ie, between the glass-transition temperature and the melt temperature. Hot-melt adhesives are based on thermoplastic polymers that may be compounded or uncompounded ethylene—vinyl acetate copolymers, paraffin waxes, polypropylene, phenoxy resins, styrene—butadiene copolymers, ethylene—ethyl acrylate copolymers, and low, and low density polypropylene are used in the compounded state polyesters, polyamides, and polyurethanes are used in the mosdy uncompounded state. 

In the area of moleculady designed hot-melt adhesives, the most widely used resins are the polyamides (qv), formed upon reaction of a diamine and a dimer acid. Dimer acids (qv) are obtained from the Diels-Alder reaction of unsaturated fatty acids. Linoleic acid is an example. Judicious selection of diamine and diacid leads to a wide range of adhesive properties. Typical shear characteristics are in the range of thousands of kilopascals and are dependent upon temperature. Although hot-melt adhesives normally become quite brittle below the glass-transition temperature, these materials can often attain physical properties that approach those of a stmctural adhesive. These properties severely degrade as the material becomes Hquid above the melt temperature. 

As appHed to hydrocarbon resins, dsc is mainly used for the determination of glass-transition temperatures (7p. Information can also be gained as to the physical state of a material, ie, amorphous vs crystalline. As a general rule of thumb, the T of a hydrocarbon resin is approximately 50°C below the softening point. Oxidative induction times, which are also deterrnined by dsc, are used to predict the relative oxidative stabiHty of a hydrocarbon resin. 

Strong-Acid Catalysts, Novolak Resins. PhenoHc novolaks are thermoplastic resins having a molecular weight of 500—5000 and a glass-transition temperature, T, of 45—70°C. The phenol—formaldehyde reactions are carried to their energetic completion, allowing isolation of the resin ... 

Substituted nonheat-reactive resins do not form a film and are not reactive by themselves, but are exceUent modifier resins for oleoresinous varnishes and alkyds. Thein high glass-transition temperature and molecular weight provide initial hardness and reduce tack oxygen-initiated cross-linking reactions take place with the unsaturated oils. 

The thermal glass-transition temperatures of poly(vinyl acetal)s can be determined by dynamic mechanical analysis, differential scanning calorimetry, and nmr techniques (31). The thermal glass-transition temperature of poly(vinyl acetal) resins prepared from aliphatic aldehydes can be estimated from empirical relationships such as equation 1 where OH and OAc are the weight percent of vinyl alcohol and vinyl acetate units and C is the number of carbons in the chain derived from the aldehyde. The symbols with subscripts are the corresponding values for a standard (s) resin with known parameters (32). The formula accurately predicts that resin T increases as vinyl alcohol content increases, and decreases as vinyl acetate content and aldehyde carbon chain length increases. 

Two resin systems based on this chemical concept are commercially available from Shell Chemical Company/Technochemie under the COMPIMIDE trademark COMPIMIDE 183 (34) [98723-11-2], for use in printed circuit boards, and COMPIMIDE 796 [106856-59-1], as a resin for low pressure autoclave mol ding (35). Typical properties of COMPIMIDE 183 glass fabric—PCB laminates are provided in Table 8. COMPIMIDE 183 offers a combination of advantageous properties, such as a high glass transition temperature, low expansion coefficient, and flame resistance without bromine compound additives. 

Other Polyimides. In 1979, Rohm Haas introduced Kamax resin, which was thought to be an /V-methylamine imidization product of poly(methyl methacrylate) (118). The product was then withdrawn, but was reintroduced in the late 1980s. The partly imidized resins are similar to poly(methyl methacrylate) but have a higher glass-transition temperature. 

Alloys exhibit physical properties, the values of which are typically the weighted average of those of its constituents. In particular, the blend exhibits a single glass-transition temperature, often closely obeying semitheoretically derived equations. Blends of two compatibiLized immiscible polymers exhibit physical properties which depend on the physical arrangement of the constituents and thus maybe much closer to those of one of the parent resins. They will also typically exhibit the two glass-transition temperatures of their constituent resins. 

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