Epoxy modulus

In order to elaborate the relationship between stoichiometric imbalance of the epoxy-amine system and its resulting elastic properties, a series of reference samples of well-defined concentration ratios r was investigated using dynamic mechanical analysis (DMA). A clear increase in the glassy epoxy modulus (as measured at 20 °C) with an increasing excess of epoxy (r< 1) was observed [32]. Notably, the observation of modulus enhancement with increasing excess of epoxy is consistent with the concentration and modulus maps of the PVP/epoxy IP. 

Reirtforcing Fibers. Reinforcing fibers greatly increase epoxy modulus, strength, impact strength, heat deflection temperature, and dimensional stability (Table 3.35). 

In Figure 5.23 the finite element model predictions based on with constraint and unconstrained boundary conditions for the modulus of a glass/epoxy resin composite for various filler volume fractions are shown. 

In Figure 5.24 the predicted direct stress distributions for a glass-filled epoxy resin under unconstrained conditions for both pha.ses are shown. The material parameters used in this calculation are elasticity modulus and Poisson s ratio of (3.01 GPa, 0.35) for the epoxy matrix and (76.0 GPa, 0.21) for glass spheres, respectively. According to this result the position of maximum stress concentration is almost directly above the pole of the spherical particle. Therefore for a... 

Special, uv-curable epoxy resins (qv) for substrate disks for optical data storage (Sumitomo BakeHte, Toshiba) excel by means of their very low birefringence (<5 nm/mm) and high Young s modulus. Resistance to heat softening and water absorption are similar to BPA-PC, but impact resistance is as low as that of PMMA. 

Carbon-Fiber Composites. Cured laminates of phenoHc resins and carbon-fiber reinforcement provide superior flammabiHty resistance and thermal resistance compared to unsaturated polyester and epoxy. Table 15 shows the dependence of flexural strength and modulus on phenoHc—carbon-fiber composites at 30—40% phenoHc resin (91). These composites also exhibit long-term elevated temperature stabiHty up to 230°C. 

Vitahium FHS ahoy is a cobalt—chromium—molybdenum ahoy having a high modulus of elasticity. This ahoy is also a preferred material. When combiaed with a properly designed stem, the properties of this ahoy provide protection for the cement mantle by decreasing proximal cement stress. This ahoy also exhibits high yields and tensile strength, is corrosion resistant, and biocompatible. Composites used ia orthopedics include carbon—carbon, carbon—epoxy, hydroxyapatite, ceramics, etc. 

Eor the case of high modulus fibers such as carbon fibers with = 240 GPa (3.5 x 10 psi), in a polymer matrix, such as epoxy resin with = 3.0 GPa (450,000 psi), the extensional modulus is approximately proportional to the fiber volume fraction and the modulus of the fibers ... 

Fig. 11. The variation of the shear modulus G of carbon-fiber-reiaforced epoxy resia as a function of the fiber volume fraction for several values of the ratio of the fiber shear modulus to that of the matrix (G /G. Ratios are noted on the curves (100,10,2).

The highly polar nature of the TGMDA—DDS system results in high moisture absorption. The plasticization of epoxy matrices by absorbed water and its effect on composite properties have been well documented. As can be seen from Table 4, the TGMDA system can absorb as much as 6.5% (by weight) water (4). This absorbed water results in a dramatic drop in both the glass transition temperature and hot—wet flexural modulus (4—6). 

The use of elastomeric modifiers for toughening thermoset resias generally results ia lowering the glass transition temperature, modulus, and strength of the modified system. More recendy, ductile engineering thermoplastics and functional thermoplastic oligomers have been used as modifiers for epoxy matrix resias and other thermosets (12). 

To achieve low stress embedding material, low modulus material such as siUcones (elastomers or gels) and polyurethanes are usually used. Soft-domain elastomeric particles are usually incorporated into the hard (high modulus) materials such as epoxies and polyimides to reduce the stress of embedding materials. With the addition of the perfect particle size, distribution, and loading of soft domain particles, low stress epoxy mol ding compounds have been developed as excellent embedding materials for electronic appHcations. 

A composite material consists of flat, thin metal plates of uniform thickness glued one to another with a thin, epoxy-resin layer (also of uniform thickness) to form a multi-decker-sandwich structure. Young s modulus of the metal is Ej, that of the epoxy resin is E2 (where E2 < Ej) and the volume fraction of metal is Vj. Find the ratio of the maximum composite modulus to the minimum composite modulus in terms of Ej, E2 and V. Which value of gives the largest ratio ... 

The two-component urethane structural adhesives are among the most difficult to characterize, simply because of the widely varying properties that are possible. These adhesives may be rigid plastics similar in modulus to standard epoxy adhesives, with glass transition temperatures of the cured adhesive being approximately 60°C. 

A unidirectional glass fibte/epoxy composite has a fibre volume fraction of 60%. Given the data below, calculate the density, modulus and thermal conductivity of the composite in the fibre direction. 

In a unidirectional Kevlar/epoxy composite the modular ratio is 20 and the epoxy occupies 60% of the volume. Calculate the modulus of the composite and the stresses in the fibres and the matrix when a stress of 50 MN/m is applied to the composite. The modulus of the epoxy is 6 GN(m. ... 

Tsai conducted experiments to measure the various moduli of glass-fiber-epoxy-resin composite materials [3-1]. The glass fibers and epoxy resin had a Young s modulus and Poisson s ratio of 10.6 x 10 psi (73 GPa) and. 22 and. 5 x 10 psi (3.5 GPa) and. 35, respectively. 

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