Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Emitter, transistor

It was natural that photoeffects were explored in heterojunctions and new photodevices considered, see for example Kruse et al. [2.45,46] and Perfetti et al. [2.47]. However, the development of Si technology removed the need for a wide gap emitter transistor, and the problem of preparing heterojunctions with electrical and optical properties conforming to the ideal caused a drastic decrease in the interest in this area. There remains some interest in heterojunctions prepared from alloy semiconductors, e.g., GaAs-Gui and PbTe-... [Pg.19]

Figure 3-8. A second-order (passive) derivative module with emitter-transistor amplifier. Ci, C2, C3 capacitors Ri, R2, R4 resistors R3 variable resistor -l-Uo operating voltage of the amplifier T npn transistor U input voltage of the module C/o output voltage of the module. Figure 3-8. A second-order (passive) derivative module with emitter-transistor amplifier. Ci, C2, C3 capacitors Ri, R2, R4 resistors R3 variable resistor -l-Uo operating voltage of the amplifier T npn transistor U input voltage of the module C/o output voltage of the module.
Figure 3-9. A second-order derivative module with impedance converter and emitter-transistor amplifier. Ci, ceramic capacitors C3, C4 low-voltage electrolyte capacitors (tantalic) ... Figure 3-9. A second-order derivative module with impedance converter and emitter-transistor amplifier. Ci, ceramic capacitors C3, C4 low-voltage electrolyte capacitors (tantalic) ...
BASIC COMMON EMfiTER TRANSISTOR AMPLIFIER The basic common-emitter transistor amplifier circuit represents the electronics work done in the Active Area instrumentation lab. [Pg.189]

Two types of wide gap emitter transistors—an nBP-pSi-nSi structure and an nBP nSi-pSi-nSi structure having a cascade junction nBP nSi-pSi emitter—were fabricated. The common emitter current gain p in the latter transistor is about 16 and the injection efficiency of the... [Pg.576]

The bipolar junction transistor (BIT) consists of tliree layers doped n-p-n or p-n-p tliat constitute tire emitter, base and collector, respectively. This stmcture can be considered as two back-to-back p-n junctions. Under nonnal operation, tire emitter-base junction is forward biased to inject minority carriers into tire base region. For example, tire n type emitter injects electrons into a p type base. The electrons in tire base, now minority carriers, diffuse tlirough tire base layer. The base-collector junction is reverse biased and its electric field sweeps tire carriers diffusing tlirough tlie base into tlie collector. The BIT operates by transport of minority carriers, but botli electrons and holes contribute to tlie overall current. [Pg.2891]

Some of tliese problems are avoided in heterojunction bipolar transistors (HBTs) [jU, 38], tlie majority of which are based on III-V compounds such as GaAs/AlGaAs. In an HBT, tlie gap of tlie emitter is larger tlian tliat of tlie base. The conduction and valence band offsets tliat result from tlie matching up of tlie two different materials at tlie heterojunction prevent or reduce tlie injection of tlie base majority carriers into tlie emitter. This peniiits tlie use of... [Pg.2891]

Fig. 5. Bipolar transistor (a) schematic and (b) doping profiles of A, arsenic ion implanted into the silicon of the emitter ( -type) B, boron ion implanted into the silicon of the base (p-type) C, antimony ion implanted into the buried layer ( -type) and D, the epi layer... Fig. 5. Bipolar transistor (a) schematic and (b) doping profiles of A, arsenic ion implanted into the silicon of the emitter ( -type) B, boron ion implanted into the silicon of the base (p-type) C, antimony ion implanted into the buried layer ( -type) and D, the epi layer...
As Figure 10 shows, the n—p—n bipolar junction transistor (BJT) may be regarded as two back-to-back p—n junctions separated by a thin base region (26,32,33). If external voltages are applied so that the base-emitter (BE) junction is forward biased and the base-coUector (BC) junction is reverse biased, electrons injected into the base from the emitter can travel to the base-coUector junction within their lifetime. If the time for minority carrier electrons to... [Pg.350]

Eigure 11 shows a schematic and collector characteristics for a common emitter n—p—n transistor circuit. The load line crossing these characteristics shows the allowed operation of the transistor with a supply voltage, = 12 V a load resistor, 7 = 2 and a bias resistor, 7 g = 20 kQ. The load line corresponds to the equation = 7 7 -H. Plotting the load line on the collector characteristics defines BJT behavior 0.6 V is required... [Pg.351]

Eig. 11. (a) Common emitter circuit and (b) output characteristics for the n—p—n transistor, where is the operating (quiescent) point as determined by Rg. [Pg.351]

A high gain transistor requires a nearly equal to 1. In the absence of collector junction breakdown, a is the product of the base transport factor and emitter efficiency. The base transport factor, a, is the fraction of the minority current (electrons for an n—p—n transistor) that reaches the collector. [Pg.351]

The frequency response or switching speed of the bipolar transistor is governed by the same processes which control the speed of thep—n junction, the capacitance associated with the movement of charge into and out of the depletion regions. To achieve high frequencies the dimensions of the active areas and parasitic circuit elements must be reduced. The two critical dimensions are the width of the emitter contact and the base thickness, W. The cutoff frequency,, is the frequency at which = 57 / - b /t > where is the emitter-to-coUector delay time and is the sum of the emitter... [Pg.352]

To achieve the lowest possible delay a bipolar switching transistor developed by IBM minimizes parasitic resistances and capacitances. It consists of self-aligned emitter and base contacts, a thin intrinsic base with an optimized collector doping profile, and deep-trench isolation (36). Devices must be isolated from each other to prevent unwanted interactions in integrated circuits. While p—n junctions can be used for isolation, IBM s approach etches deep trenches in the siUcon wafer which are filled with Si02 to provide electrical insulation. [Pg.352]

In an HBT the charge carriers from an emitter layer are transported across a thin base layer and coUected by a third layer called the coUector. A small base current is present which iacludes the carriers that did not successfully cross the base layer from the emitter to the coUector. The FET is a unipolar device making use of a single charge carrier in each device, either electrons or holes. The HBT is a bipolar device, using both electrons and holes in each device. The emitter and coUector layers are doped the same polarity n- or -type), with the base being the opposite polarity (p- or n-ty- e). An HBT with a n-ty e emitter is referred to as a n—p—n device ap—n—p device has a -type emitter. The n—p—n transistors are typicaUy faster and have been the focus of more research. For the sake of simplicity, the foUowing discussion wiU focus on n—p—n transistors. [Pg.373]

This design adds the overeurrent proteetion externally to the IC. It employs the base-emitter (0.6 V) junetion of a transistor to aeeomplish the overeurrent... [Pg.17]

The seeond seheme, shown in Figure 3-34, is ealled proportional base drive and always drives the transistor at or just below the transistor s saturation state. The eolleetor-emitter voltage is higher than with fixed base drive, but the transistor ean now switeh in about 100 to 200 nS. This is five to ten times faster than with fixed base drive. In praetiee, though, the fixed base drive seheme is used in the majority of low- to medium-power, low-eost applieations. Proportional base drive is used for the higher-power applieations. [Pg.65]

On the primary side of the power supply, the transistor output of the optoiso-lator will be a simple eommoii-emitter amplifier. The MOC8102 has a typieal eurreiit transfer ratio of 100 pereeiit with a +/- 25 pereeiit toleraiiee. When the TL431 is full-on, 6mA will be drawn from the transistor within the MOC8102. The transistor should be in a saturated state at that time, so its eolleetor resistor (Rl) must be... [Pg.129]

Certain features in the PR spectra at 300 K from GaAs/Gai j,jAlj heterojunction bipolar transistor structures have been correlated with actual device performance thus PR can be used as an effective screening tool. From the observed FK oscillations it has been possible to evaluate the built-in dc electric fields in the Gai j jAlj emitter, as well as in the n—GaAs collector region. The behavior... [Pg.393]

A transistor, or n-p-n junction, is built up of two n-type regions of Si separated by a thin layer of weakly p-type (Fig. e). When the emitter is biased by a small voltage in the forward direction and the collector by a larger voltage in the reverse direction, this device acts as a triode amplifier. The relevant energy level diagram is shown schematically in Fig. f... [Pg.332]

Silicon is also alloyed with germanium (Si Gei.x) for applications such as heterojunction bipolar transistors and optical emitters... [Pg.224]

Transistors, which control the current through a junction of semiconductor materials by a voltage signal from an emitter electrode. [Pg.348]

Output Characteristics for a p-n-p Transistor in Common-Emitter Mode... [Pg.312]


See other pages where Emitter, transistor is mentioned: [Pg.301]    [Pg.72]    [Pg.740]    [Pg.519]    [Pg.557]    [Pg.576]    [Pg.112]    [Pg.301]    [Pg.72]    [Pg.740]    [Pg.519]    [Pg.557]    [Pg.576]    [Pg.112]    [Pg.2891]    [Pg.2891]    [Pg.351]    [Pg.351]    [Pg.352]    [Pg.352]    [Pg.116]    [Pg.117]    [Pg.113]    [Pg.13]    [Pg.14]    [Pg.15]    [Pg.63]    [Pg.81]    [Pg.139]    [Pg.394]    [Pg.312]   
See also in sourсe #XX -- [ Pg.285 ]




SEARCH



Emittance

Emitters

Transistor common-emitter circuit

Transistor emitter electrode

Wide gap emitter transistor

© 2024 chempedia.info