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Electroplating element

Nevertheless, modem methods of electroanalytical chemistry can, in certain instances, either successfully complement atomic absorption spectroscopy or provide information not otherwise obtainable. A synergistic effect can, in fact, be obtained by a combination of the two techniques, and such work has been described by Lund and Larsen (39) and by Fairless and Bard (40). Controlled potential electrolysis is first used to preconcentrate the element or elements of interest on an electrode. This step also separates the elements from the matrix and possibly from interfering elements. The electroplated elements are then removed and measured by atomic absorption. The combination of the two techniques seems ideal for problems in petroleum trace metal analysis. Much research remains to be done, however, before its applicability can be defined. [Pg.47]

Nickel [7440-02-0] Ni, recognized as an element as early as 1754 (1), was not isolated until 1820 (2). It was mined from arsenic sulfide mineral deposits (3) and first used in an alloy called German Silver (4). Soon after, nickel was used as an anode in solutions of nickel sulfate [7786-81 A] NiSO, and nickel chloride [7718-54-9] NiCl, to electroplate jewelry. Nickel carbonyl [13463-39-3] Ni(C02)4, was discovered in 1890 (see Carbonyls). This material, distilled as a hquid, decomposes into carbon monoxide and pure nickel powder, a method used in nickel refining (5) (see Nickel and nickel alloys). [Pg.9]

In an electroplating process, once the concentration of the element of interest, e.g. Cu2+, is sufficiently low, the impurity metal cations will start plating out of solution onto the object (cathode - source of electrons). The order of plating depends both on the reduction potentials of the metals and their concentrations. If we assume that the impurity concentrations are the same in the solution, then the most easily reduced species will be the first one to plate out. This is the metal with the most positive standard reduction potential. Of the metals given in the problem, the order in which the metals will plate out is ... [Pg.373]

X-ray methods include x-ray diffraction, x-ray absorption, and x-ray fluorescence. X-ray diffraction is a technique for determining ultrasmall spacings in materials, such as the spacings between the atoms or ions in a crystal structure, or the thickness of a thin electroplated material. An example of the former is in soil laboratories in which the minerals in various soils need to be characterized. X-ray absorption is limited in application, but has been used to determine heavy elements in a matrix of lighter elements, such as determining lead in gasoline. X-ray fluorescence is much more popular and is used to determine elements in a wide variety of solid materials. [Pg.275]

Rhodium is one of the six platinum transition elements that include Ru, Rh, Pd, Os, Ir, and Pt. Of these metals, rhodium has the highest electrical and thermal conductivity. Although a relatively scarce metal, rhodium makes an excellent electroplated surface that is hard, wears well, and is permanently bright— ideal for plating the reflectors in automobile headlights. [Pg.136]

Elemental copper is the least easily oxidized of the first-row transition metals. This largely accounts for the extensive use of copper electrodeposition for both industrial applications and analytical purposes. Since the electrochemistry of elemental copper, including electrodeposition, electroplating, and electrowinning, was treated extensively in the previous edition of this encyclopedia [1] and detailed descriptions are to be found elsewhere [2-4], it is not covered in this treatise. [Pg.993]

Electron Configuration distribution of electrons into different shells and orbitals from the lower to higher energy levels Electronegativity measure of the attraction of an element for a bonding pair of electrons Electroplating process where a metal is reduced on to the surface of an object, which serves as the cathode in an electrochemical cell... [Pg.340]


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See also in sourсe #XX -- [ Pg.41 , Pg.56 , Pg.59 , Pg.60 , Pg.61 , Pg.62 , Pg.69 , Pg.73 , Pg.98 , Pg.99 , Pg.100 , Pg.102 , Pg.110 , Pg.112 , Pg.113 , Pg.124 , Pg.136 , Pg.146 , Pg.149 , Pg.177 , Pg.278 , Pg.290 ]




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Electroplating

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