Electronic materials and processes

Problems and Prospects of Instrumental Surface Analysis of Electronic Materials and Processes... 

In this review, the process steps in IC fabrication and the major new technologies utilized are discussed. Numerous examples of the application of instrumental surface analysis in the Study of electronic materials and processing are given. 

Gary E. McGuire, Microelectronics Center of North Carolina (Electronic Materials and Processing)... 

Dibbs MG, Townsend PH, Stokich TM, Huber BS, Mohler CE, Heistand RH, Garrou PE, Adema GM, Berry MJ, Turlik I. Cure management of benzocyclobutene dielectric for electronic applications. In Proceedings of SAMPE Electronic Materials and Processing Conference 1992. p 1-10. 

C.A. Harper, Electronic Materials and Processes Handbook, McGraw-Hill (2003)... 

Iwami C, Licari JJ, Nakagawa C. New Adhesive requirements for multichip modules, Proc. 5th Inti. SAMPE Electronic Materials and Processes Conf. Los Angeles Jun 1991. Harper PR. Thermoplastic die attach for hermetic packaging. Inti. J. Microelectronics and Electronic Packaging. 4th Quarter 1994 17(4). 

Swanson, D. W., Qualification of a High-Purity, Low Outgassing Conductive Adhesive for Hybrid Microcircuit Assembly, Proc. 5 Annual SAMPE Electronic Materials and Processes Conf, (Jun. 1989)... 

Iwami, C., Licari, J. J., andNakagawa, C., New Adhesive Requirements for Multichip Modules, Proc. 5 Inti. SAMPE Electronic Materials and Processes Conf., Los Angeles (Jun. 1991)... 

Harvey, J. A. In Proceedings of the 3rd International SAMPE Electronic Materials and Process Conferences Los Angeles, CA, 1989 p 124. 

Shuldt, G., and McKay, C., Amalgams for Electronics Interconnect, Proceedings of the Seventh Electronic Materials and Processing Congress, 1992, pp. 141-145. 

L. T. Nguyen and C. A. Kovac, SAMPLE Electronics Materials and Processes Conference, 1987. 

The competitive nature of manufacturing of microelectronics has meant that completely new generations of devices and completely new electronic materials and processes have been required on a time scale of months rather than years or decades. One consequence of this situation is that a book covering materials specific to the... 

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