Electronic circuit miniaturization

The pursuit of further miniaturization of electronic circuits has made submicrometer resolution Hthography a cmcial element in future computer engineering. LB films have long been considered potential candidates for resist appHcations, because conventional spin-coated photoresist materials have large pinhole densities and variations of thickness. In contrast, LB films are two-dimensional, layered, crystalline soHds that provide high control of film thickness and are impermeable to plasma down to a thickness of 40 nm (46). The electron beam polymerization of CO-tricosenoic acid monolayers has been mentioned. Another monomeric amphiphile used in an attempt to develop electron-beam-resist materials is a-octadecylacryUc acid (8). 

A major challenge and important application is nano-wiring of electronic circuits mediated by self-assembled DNA or protein structures providing condncting connection between miniaturized electrodes [51,52]. The use of self-assembled DNA for wiring two... 

In 1958, Jack Kilby (1923-2005), a researcher atTexas Instruments, invented a miniature electronic circuit known as an integrated circuit. Modern integrated circuits, which contain many electronic components etched on a thin wafer of silicon, have become a vital part of many devices, especially computers. Placing a large number of electronic components in such a small area has greatly reduced the size of electronic equipment. 

Epitaxy—The growth of crystalline layers of semiconducting materials in a layered structure. Integrated circuits—Complex electronic circuits fabricated using multiple growth and lithography/ pattern transfer stages to produce many miniature electronic elements on a monolithic device. 

The future of electronic circuits capable of information storage and processing greatly depends on the continued miniaturization trend that we have seen since the invention of the transistor. The long run of semiconductor-based devices fabricated with lithographic techniques seems to be near its end as we are quickly approaching their lowest possible sizes both from intrinsic properties and manufacturing standpoints. In this context, molecular devices appear as an ideal way to overcome these difficulties and continue the circuit... 

A second type of separating element, developed by Siemens AG, is fabricated by photoetching of metal foils by techniques used in miniaturizing electronic circuits. The left side of Fig. 14.25 is an enlarged contact print of such an etched foil. The middle of Fig. 14.25 shows how these foils are stacked into chips held by cover plates pierced with holes in register with the feed and heavy fraction passages. The right side of Fig. 14.25 shows assembly of chips into a tube. 

As described above the progress of present-day lithographic techniques guided by the miniaturization of conventional electronic circuits fails to fulfil the requirements of single electronics at elevated temperature, a requirement which extends to a size range of a few nanometers or less3 ... 

Hybrid circuit Electronic circuit combining miniature active and passive components on a single ceramic substrate. 

Molecular electronics represents a pow-erfiil approach to the continued miniaturization of electronic circuits down to the lower nanometer scale. One significant challenge is the electrical connection of molecular devices by nanowires. In this regard, the ability of microelectrodes, to both image, for example, through SECM and fabricate, for example, through spatially controlled electrodeposition, micro- and nano-structures will continue to be invaluable. 

Integrated circuit (Robert Norton Noyce and Jack St. Oair Kilby) The microchip, independently discovered by Noyce and Kilby, proves to be the breakthrough that allows the miniaturization of electronic circuits and paves the way for the digital revolution. 

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