Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Electroless Nickel Immersion Gold ENIG

IPC-4552, Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards, October 2002. [Pg.773]

The substrate surfaces of choice are usually one of the following electroless nickel/immersion gold (ENIG), immersion silver (ImAg), and organic solderability preservative (OSP). Two other finishes, hot air solder leveling (HASL) and immersion tin, are also in use, but HASL has declined in volume and immersion tin has not reached significant volumes due to concerns over reliability. [Pg.1016]

Other surface finish-delated defects Immersion silver (Imm-Ag) sometimes exhibits hn-ear arrays of microvoids at the intermetalhc interface which detracts from solder joint strength. Electroless nickel/immersion gold (ENIG) sometimes results in brittle fracture if the plating chemistries are not maintained properly. [Pg.1047]

Deepak Goyal.Tim Lane, Patrick Kinzie, Chris Panichas,Kam Meng Chong, Oscar Villalobos, Failure Mechanisms of Brittle Solder Joint Fracture in the Presence of Electroless Nickel Immersion Gold (ENIG) Interface, Electronic Components and Technology Conference, 2004, pp. 732-139. [Pg.1395]

This chapter reviews Uteratme on the microstructure of solder joints and the interactions of solders with substrates and related solder joint reliability issues. The substrates here are limited to Cu, Ni-coated Cu, electroless nickel/ immersion gold (ENIG), and hot air solder leveled (HASL) Sn-Pb. The solders are mainly Sn, eutectic or near eutectic Sn-Ag, and Sn-Ag-Cu alloys. Specific reliability issues discussed here include black pads of ENIG, gold embrittlement, compatibility of Pb-free solders with Pb-containing surface finish, and Kirkendall voids. [Pg.29]

The electroless nickel/electroless palladium/immersion gold (ENEPIG) finish is simply an ENIG finish into which an intermediate layer of palladium (0.1 to 0.5 pm thick) is deposited between the electroless nickel and immersion gold coatings. Palladium is deposited from an autocatalytic plating bath. Palladium is a noble metal applied to protect oxidizable Ni. Palladium (m.p. 1552°C) is not fusible but rather dissolves in the molten solder in a manner similar to gold, and... [Pg.441]

ENIG electroless nickel and immersion gold (Ni/Au) QA quality assurance... [Pg.282]

See other pages where Electroless Nickel Immersion Gold ENIG is mentioned: [Pg.752]    [Pg.756]    [Pg.1048]    [Pg.1381]    [Pg.1395]    [Pg.435]    [Pg.439]    [Pg.491]    [Pg.752]    [Pg.756]    [Pg.1048]    [Pg.1381]    [Pg.1395]    [Pg.435]    [Pg.439]    [Pg.491]    [Pg.75]    [Pg.99]    [Pg.764]   


SEARCH



Immersed

Immersion

Nickel electroless

© 2024 chempedia.info