Electrical resistivity, polymer packaging materials

Polymer-matrix composites have been used as one of the most common packaging materials for encapsulating a variety of electronic components for dissipating heat [14]. In this section, 3D AlN nanowhiskers with brush-hke structure were filled into the polymer matrix to enhance its thermal conductivity. The 3D brush-hke AlN fiUers were fabricated by CS process [7a], as iUustrated in Section 3.2. The use of AlN as a filler candidate to enhance the thermal conductivity of the polymer is attributed to its attractive properties such as high thermal conductivity, high electrical resistivity, and good chemical stabihty with polymers [1]. To explore the promoting effect of the 3D brush-hke AIN fillers on thermal conductivity, three types of AIN fillers with different brush-hke filler aspect ratio were added into polymer matrix to fabricate a series of composites and their thermal conductivities were measured. The results demonstrated that the 3D brush-hke AIN nanowhiskers fillers can effectively enhance the thermal conductivity of the polymer composite. 

New Polymers and Other Modes of Deformation.—Three relatively new polymers have become available recently poly (ether ketones), poly (ether ether ketones) and poly(ether sulphones). Poly(ether ether ketones), (PEEK), have good electrical insulating properties and very good abrasion resistance. This combination makes the polymer an attractive coating for electrical conductors. The same polymer is also attractive as a load bearing material for moving parts. Poly(phenylene sulphide) continues to be developed for this purpose but the PEEKS are much simpler to fabricate. Linear low-density polyethylenes are expected to be widely available in the near future. These materials have many attractive features, particularly as packaging materials. 

Tuned Conductive Coatings. One of the major uses of conductive polymer coatings is in electrostatic discharge protection. For effective electrostatic discharge protection, the ideal situation is one wherein the electrical charges are dissipated nearly as rapidly as they are generated. In order to do this effectively, the surface resistance of the packaging material should be less than 10 ... 

Polyethylene is the most common thermoplastic polymer with multiple applications insulating materials in electrical cables, pipes, packaging (bags, film, containers, a. s. o.), medical devices and other fields because of its good chemical and stress-crack resistance besides high strength. 

Viljanmaa M, Sodergard A et al (2002) Lactic acid based polymers as hot melt adhesives for packaging applications. Int J Adhes Adhes 22 219 Welsh J, Higgins J et al (2003) Evaluation of electrically disbonding adhesive properties for use as separation systems. In AIAA 2003-1436 (44th AIAA/ASME/ ASCE/AHS structures, structural dynamics, and materials conference), Norfolk, USA, pp 1-3 Yamada K, Chen T et al (2000) Chitosan based water-resistant adhesive. Analogy to mussel glue. Biomacromolecules 1 252... 

The principal used in polymer-clay nanocomposites leads the individual clay layers as well as the polymer chains to function more effectively with numerous improved properties such as high moduli, increased strength and heat resistance, decreased gas permeability and flammability, increased biodegradability of biodegradable polymers, and attractive electrical properties when compared to virgin polymers or conventional micro- and macrocomposites [37]. These properties make them ideal materials for applications in food packaging, structural automotive components, and electronics among others. 

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