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Dopants, requirements

Semiconductors. Phosphine is commonly used in the electronics industry as an -type dopant for siUcon semiconductors (6), and to a lesser extent for the preparation of gaUium—indium—phosphide devices (7). For these end uses, high purity, electronic-grade phosphine is required normally >99.999% pure. The main impurities that occur in phosphine manufactured by the acid process are nitrogen [7727-37-9] hydrogen [1333-74-0] arsine [7784-42-17, carbon dioxide [124-38-9], oxygen [7782-44-7], methane [74-82-8], carbon monoxide [630-08-0], and water [7732-42-1]. Phosphine is purified by distillation under pressure to reduce the level of these compounds to <1 ppm by volume. The final product is sold as CYPURE (Cytec Canada Inc.) phosphine. [Pg.318]

Inherently Conducting Polymers. Conducting polymers are polymers with a pi-electron backbone capable of passing an electrical current. These polymers generally are not sufficiently conductive as neat polymers but require the inclusion of an oxidi2ing or reducing agent (dopant) to render them conductive. [Pg.296]

The most common application of dynamic SIMS is depth profiling elemental dopants and contaminants in materials at trace levels in areas as small as 10 pm in diameter. SIMS provides little or no chemical or molecular information because of the violent sputtering process. SIMS provides a measurement of the elemental impurity as a function of depth with detection limits in the ppm—ppt range. Quantification requires the use of standards and is complicated by changes in the chemistry of the sample in surface and interface regions (matrix efiects). Therefore, SIMS is almost never used to quantitadvely analyze materials for which standards have not been carefiilly prepared. The depth resoludon of SIMS is typically between 20 A and 300 A, and depends upon the analytical conditions and the sample type. SIMS is also used to measure bulk impurities (no depth resoludon) in a variety of materials with detection limits in the ppb-ppt range. [Pg.528]

Shallow doping profiles, particularly those of As, require nanoscale information on dopant distribution. Although SIMS can be reliably applied for layers below 5 nm... [Pg.191]

The term solid-state laser refers to lasers that use solids as their active medium. However, two kinds of materials are required a host crystal and an impurity dopant. The dopant is selected for its ability to form a population inversion. The Nd YAG laser, for example, uses a small number of neodymium ions as a dopant in the solid YAG (yttrium-aluminum-gar-net) crystal. Solid-state lasers are pumped with an outside source such as a flash lamp, arc lamp, or another laser. This energy is then absorbed by the dopant, raising the atoms to an excited state. Solid-state lasers are sought after because the active medium is relatively easy to handle and store. Also, because the wavelength they produce is within the transmission range of glass, they can be used with fiber optics. [Pg.705]

The process of substituting elements for the silicon is called doping, while the elements are referred to as dopants. The amount of dopant that is required in practical devices is very small, ranging from about 100 dopant atoms per million silicon atoms downward to 1 per billion. Dopants are usualty added to the silicon after the crystal growth process, when an integrated circuit is being formed on the surface of the wafer. [Pg.312]

All materials will, to some degree, be subject to corrosion and oxidation by their environment, and the critical early stages of attack can often be understood through the use of surface analytical techniques. A similar approach is required to gain an understanding of the fundamental and applied aspects of surface catalysis, which is of great importance in the petrochemical industry. The microelectronics industry has also contributed to the development of modern surface analytical techniques, where there is a necessity to analyse dopant concentration profiles while retaining lateral resolution on the device of better than one micron. [Pg.228]


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See also in sourсe #XX -- [ Pg.336 ]




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