Direct-flow-based contacting

A scrubber cleaning process can be optimized by adjusting the brush and wafer rotation speed, the DI water/chemical flow rate, and the gap between the brush and the wafer surface. Because brush cleaning is based on the mechanical pressure applied to the wafer surface, the brush must be compressed to the wafer surface to have either direct or semidirect contact with the wafer to effectively remove fine particles. 

AFPR USA XI BWR or direct flow system with TRISO fuel 100/300 36 UO2 based micro fuel elements in direct contact with coolant 8-13 Forced circulation H2O 270/291 (BWR version) Direct Rankine ... 

Factors related to the boundary conditions are type of flow, flow direction, flow rate (parallel flow), hydraulic gradient, continuity of the contact at the base soil—filter interface, vertical effective stress, and shear stresses at the soil—filter interface. 

Contact temperature measurement is based on a sensor or a probe, which is in direct contact with the fluid or material. A basic factor to understand is that in using the contact measurement principle, the result of measurement is the temperature of the measurement sensor itself. In unfavorable situations, the sensor temperature is not necessarily close to the fluid or material temperature, which is the point of interest. The reason for this is that the sensor usually has a heat transfer connection with other surrounding temperatures by radiation, conduction, or convection, or a combination of these. As a consequence, heat flow to or from the sensor will influence the sensor temperature. The sensor temperature will stabilize to a level different from the measured medium temperature. The expressions radiation error and conduction error relate to the mode of heat transfer involved. Careful planning of the measurements will assist in avoiding these errors. 

Direct conversion processes use chemical reactions to oxidize H2S and produce elemental sulfur. These processes are generally based either on the reaction of H2S and O2 or H2S and SO2. Both reactions yield water and elemental sulfur. These processes are licensed and involve specialized catalysts and/or solvents. A direct conversion process can be ii.scd directly on the produced gas stream. Where large flow rates are encoLui tered. ii is more common to contact the produced gas stream with a chemical or physical solvent and use a direct conversion proce.ss on the acid cas liberated in the regeneration step. 

LOCAT units can be used for tail-gas clean-up from chemical or physical solvent processes. They can also be used directly as a gas sweetening unit by separating the absorber/oxidizer into two vessels. The regenerated solution is pumped to a high-pres.sure absorber to contact the gas. A light slurry of rich solution comes off the bottom of the absorber and flows to an atmospheric oxidizer tank where it is regenerated. A dense slurry is pumped off the base of the oxidizer to the melter and sulfur separator. 

Developed by Freeman and Tavlarides [45,46], and based on the liquid jet technique [47,48], the LJRR provides a method of measuring liquid-liquid reaction kinetics with direct contact, known interfacial area, renewable interface, and reasonably defined hydrodynamics. This method operates by employing an aqueous liquid jet in a concurrent, coaxially flowing organic solution, shown schematically in Fig. 8. 

R 17] [A 5] The general set-up of these inline sensors always follows a uniform structure (Figure 4.69). A sensor is in direct contact with the fluid in a flow cell in the base plate. From here the analog signal is converted into a digital signal and further processed in a micro processor before it is send to the communication bus. 

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