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Dielectric RAMs

Typically, practical graded dielectric RAMs are constructed of discrete layers, with properties changing from layer to layer. A technique for reducing the reflection from the front face of a flat absorber is to use semiconductive foams obtained by impregnation with carbon or dispersion of carbon fibrils. A careful combination of these foams with an internal magnetic layer of the iron-filled elastomer type leads to wide bandwidth materials which can operate readily between 4 and 18 GHz [29] as shown in Figure 8.3,... [Pg.374]

The nanotechnology report issued in February 2004 by the UK Royal Society makes the general observation that Electrical transport properties across interfaces remain poorly understood in terms of science/predictive capability. This affects all nanomaterials . This observation most keenly summarizes the present state of play for Gbit level random access memories (RAMs), and it is our view that the electrode interface issues may dominate the device physics. Within the nanotech roadmap , high-dielectric ( high-K ) materials are strongly emphasized, as are nanotubes and new interconnects. [Pg.199]

Fig. 1. Three THz-scans at 10K The pulse transmitted through air (Efree(tJ), the unexcited sample (E,ram(t)), and the photoexcited sample ( , (/)). The 45ps delay between and E,rani is caused by the large real part of the dielectric function (see inset of Fig. 2). A less obvious phase shift also exists between E,mns and associated with the real part of e. Inset Left - the (001) face of rutile. Right - the lattice distortion when an electron is placed in the polar lattice results in polaron formation (partly) positively charged Ti-atoms are attracted, and (partly) negative O-atoms repelled (see text). Fig. 1. Three THz-scans at 10K The pulse transmitted through air (Efree(tJ), the unexcited sample (E,ram(t)), and the photoexcited sample ( , (/)). The 45ps delay between and E,rani is caused by the large real part of the dielectric function (see inset of Fig. 2). A less obvious phase shift also exists between E,mns and associated with the real part of e. Inset Left - the (001) face of rutile. Right - the lattice distortion when an electron is placed in the polar lattice results in polaron formation (partly) positively charged Ti-atoms are attracted, and (partly) negative O-atoms repelled (see text).
When very thin Si02 layers are required such as a gate oxide in an MOS-field effect transistor (MOSFET) or when an Si02 layer is required as an insulating layer between layers in a multilevel device the CVD process is used. The dielectric is an active component of the storage capacitor in dynamic RAMs, and its thickness determines the amount of charge that can be stored (see Chapter 31). [Pg.549]

High-Tc- superconductors Dielectrics Thin film/bulk devices capacitors, sensors, phase shifters, dynamic RAMS YB32C U307, BsTi03... [Pg.369]

Values and units Dielectric strength (kV/mm) Dielectric strength (kV/ram)... [Pg.943]


See other pages where Dielectric RAMs is mentioned: [Pg.528]    [Pg.416]    [Pg.159]    [Pg.246]    [Pg.247]    [Pg.107]    [Pg.453]    [Pg.480]    [Pg.84]    [Pg.161]    [Pg.431]    [Pg.553]    [Pg.280]    [Pg.110]    [Pg.416]    [Pg.280]    [Pg.1907]    [Pg.13]    [Pg.142]    [Pg.351]    [Pg.44]   
See also in sourсe #XX -- [ Pg.374 ]




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