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Dielectric epoxies

Electronic/optical materials Fluxes (low solids and tacky) Photoresists Dielectrics, epoxies... [Pg.213]

Dielectric epoxy film, highly thermally conductive ESP 7676-HF A1T echnology 80 40 100... [Pg.81]

Dielectric Epoxy, polyester and emulsions [99, 100] Non-invasive, continuous, it can be used during synthesis and curing/ System-specific, few examples in the literature Polycondensation and emulsion polymerization... [Pg.326]

Grade G-10, glass fabric with epoxy resin binder, has extremely high mechanical strength (flexural, impact, and bonding) at room temperature and good dielectric loss and electric strength properties under both dry and humid conditions. [Pg.537]

Sihcones (qv) have an advantage over organic resias ia their superior thermal stabiUty and low dielectric constants. Polyurethanes, when cured, are tough and possess outstanding abrasion and thermal shock resistance. They also have favorable electrical properties and good adhesion to most surfaces. However, polyurethanes are extremely sensitive to and can degrade after prolonged contact with moisture as a result, they are not as commonly used as epoxies and sihcones (see Urethane polymers). [Pg.531]

These transformers may be PVC taped, thermoplastic (polypropylene) moulded, fibreglass taped, polyester resin cast or epoxy resin cast depending upon the system voltage and the surroundings. HT indoor transformers, for instance, are generally polyester or epoxy resin cast, and are economical with good dielectric properties. They are resistant to humid, chemically contaminated and hazardous areas. Outdoor HT transformers, how-ever. may be epoxy... [Pg.457]

The elements thus formed are then inserted into a sheet steel container, vacuum dried and impregnated, with suitable non-PCB dielectric, which may be an oil dielectric or epoxy resin. The capacitor shell is then hermetically sealed, in oil dielectrics, to avoid any leakage of dielectric during operation. [Pg.811]

Until the 1970s the chemical used as the impregnating and dielectric medium for capacitor units was PCB (polychlorinated biphenyl) liquid. It was found to be toxic and unsafe for humans as well as contamination of the environment. For this reason, it is no longer used. The latest trend is to use a non-PCB, non-toxic, phenyl xylyl ethane (PXE-oil), which is a synthetic dielectric liquid of extremely low loss for insulation and impregnation of the capacitor elements or to use mixed polypropylene or allpolypropylene (PP) liquids as the dielectric. A non-oil dielectric, such as epoxy resin, is also used. [Pg.811]

For total impregnation of the capacitor unit, a nonoil dielectric such as flexible epoxy is used lo eliminate leakage... [Pg.813]

Void-free phenolic networks can be prepared by crosslinking novolacs with epoxies instead of HMTA. A variety of difunctional and multifunctional epoxy reagents can be used to generate networks with excellent dielectric properties.2 One example of epoxy reagents used in diis manner is the epoxidized novolac (Fig. 7.34) derived from the reaction of novolac oligomers with an excess of epichlorohydrin. [Pg.411]

Phthalazinone, 355 synthesis of, 356 Phthalic anhydride, 101 Phthalic anhydride-glycerol reaction, 19 Physical properties. See also Barrier properties Dielectric properties Mechanical properties Molecular weight Optical properties Structure-property relationships Thermal properties of aliphatic polyesters, 40-44 of aromatic-aliphatic polyesters, 44-47 of aromatic polyesters, 47-53 of aromatic polymers, 273-274 of epoxy-phenol networks, 413-416 molecular weight and, 3 of PBT, PEN, and PTT, 44-46 of polyester-ether thermoplastic elastomers, 54 of polyesters, 32-60 of polyimides, 273-287 of polymers, 3... [Pg.593]

Gel time values of the three systems measured as abrupt change in the slope of G (t) under isothermal curing conditions show that gelation occurs earlier in PWE system at all temperatures considered as shown in Table 11.27. ETPI behaves like a catalyst for the primary epoxy-amino reaction which dominates the cure until vitrihcation occurs. Dynamic mechanical analysis and dielectric spectroscopic analysis carried out by the authors also confirm the above conclusions. [Pg.342]

Figure 9.14 shows the low-temperature dependence of the dielectric constant for an epoxy (Emerson Cuming, Stycast 1266) [94]. [Pg.228]

This task represents a continuation of efforts to maximize the hydrophobicity of acrylic, epoxy, and other polymeric systems for resistance to water penetration and environmental degradation, and to minimize the dielectric constant and improve the processability for adhesives and coatings, without compromising the necessary structural characteristics for materials used for, e.g., structural elements, liners, paints, and microelectronic devices. [Pg.182]

Figure 4.12 The lay up of a thick TGDDM epoxy (Hercules 3501-6) graphite laminate autoclave run showing the positions of the dielectric sensors and thermocouples... Figure 4.12 The lay up of a thick TGDDM epoxy (Hercules 3501-6) graphite laminate autoclave run showing the positions of the dielectric sensors and thermocouples...
Amines were one of the first hardeners of epoxy resins 1 12), and at present they retain their leading position among all known hardeners of this type. The amine hardeners will most likely also be used in the future because they are fairly accessible, highly reactive, and their properties can be readily modified. The mechanical properties of the cured resins obtained are far better than those of the known polymer binders 2 -4), they have high dielectric characteristics, chemical resistance, etc. [Pg.115]


See other pages where Dielectric epoxies is mentioned: [Pg.498]    [Pg.498]    [Pg.539]    [Pg.537]    [Pg.149]    [Pg.111]    [Pg.124]    [Pg.811]    [Pg.811]    [Pg.226]    [Pg.61]    [Pg.69]    [Pg.341]    [Pg.101]    [Pg.861]    [Pg.246]    [Pg.434]    [Pg.36]    [Pg.22]    [Pg.62]    [Pg.87]    [Pg.235]    [Pg.111]    [Pg.213]    [Pg.246]    [Pg.247]    [Pg.105]    [Pg.106]    [Pg.592]    [Pg.463]    [Pg.153]    [Pg.187]   
See also in sourсe #XX -- [ Pg.215 , Pg.216 , Pg.229 ]




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