Diamond saw

Such samples can be machined by means of a low-speed diamond saw (e.g., Buehler Isomet ). 

In his work, Wallace [12] formed inkjet printheads from the rectangular blocks made of piezoelectric material. A diamond saw is used to create fluid channel grooves and channel actuator structures. These grooves are approximately 1 pm apart, 360 pm deep and 170 pm wide. Next, a cover plate is attached to the top of the grooves to form an enclosed rectangle channel for the working fluids. A polymer orifice plate (see Fig. 11.3) with many 40 pm diameter orifices is attached to the other end of the grooves. 

The Ru single crystal was oriented by Laue x<-ray back-scattering to within 1° of the Ru(001) plane, cut by a diamond saw and mechanically polished. After being etched in hot aqua regia for about 15 min, the crystal was spot welded to two tantalum heating wires which were connected to two stainless steel electrodes on a sample manipulator. The temperature was monitored by a Pt/Pt-10% Rh thermocouple which was spot welded to the back of the crystal. 

Bulk samples were sectioned with a diamond saw to provide samples for the Rheovibron DDV II Viscoelastometer operated at 11 Hz. In some cases a thin sheet cured between aluminum plates, was heated to the rubbery state, cut while hot, then returned to the oven to complete the cure. 

Table I lists the comparative parameters for the various indochinite spectra. Two methods were used in preparing these samples. The first two samples listed were prepared by grinding the indochinite specimen and binding the powder with water glass. The other samples were sliced with a diamond saw. The two spectral lines are given with their position, width, height, and area. The quadrupole splitting and isomer shift are listed in the columns labeled QS and IS. (The isomer shift is really a combination of isomer shift and temperature-dependent shift, and the values are relative to iron in palladium.) The raw data points were fitted with a two-peak Lorentzian using an IBM 7094 least-squares fit.

They were then cut with a diamond saw to form 8-mm-long cylindrical plugs and evaluated for diametral tensile strength using an Instron tester. Testing results of selected experimental agents are provided in Table 2. 

Construction of electronic devices usually involves deposition of thin layers of semiconducting, metallic, and insulating materials onto a suitable substrate (which might be a wafer cut from a Czochralski silicon boule with a diamond saw).15-24 In some cases, it is possible to grow crystalline layers onto a substrate such that the crystallographic order of the atoms in the film is related to that of the surface of the substrate this is known as epitaxial growth. 

The ends or tails of the single-crystal ingot are removed using a water-lubricated single-bladed diamond saw, with various coolants added to the water. 

While we have not yet carried out detailed kinetic measurements on the rate of photocorrosion, our impression is that the process is relatively insensitive to the specific composition of the strontium titanate. Trace element compositions, obtained by spark-source mass spectrometry, are presented in Table I for the four boules of n-SrTi03 from which electrodes have been cut. Photocorrosion has been observed in samples from all four boules. In all cases, the electrodes were cut to a thickness of 1-2 mm using a diamond saw, reduced under H2 at 800-1000 C for up to 16 hours, polished with a diamond paste cloth, and etched with either hot concentrated nitric acid or hot aqua regia. Ohmic contacts were then made with gallium-indium eutectic alloy, and a wire was attached using electrically conductive silver epoxy prior to mounting the electrode on a Pyrex support tube with either epoxy cement or heat-shrinkable Teflon tubing. 

Composite samples are sectioned with a diamond saw and mounted in cold curing epoxy resin. Because of their porous nature, the composites are infiltrated under vacuum and subsequently cured under pressure in order to force the mounting resin into the pores. Mounted samples are ground flat on 240 grit silicon carbide paper, finely ground with a 9 pm oil-based diamond slurry and finally polished with a 1 pm diamond slurry and a 50 nm silica suspension. 

Drost et al. [129] developed an evaporator combined with a micro scale combustion chamber for homogeneous combustion of hydrocarbons (Figure 2.82). The main focus of the work was to maintain a stable combustion of the fuel avoiding NOx formation. Evaporation tests were carried out under isothermal conditions. Fifty-four parallel channels, 270 pm wide and 1 000 pm deep with a length of20.52 mm, were cut into a copper substrate with a diamond saw. 

For PIGE measurements, transverse bone sections are cut with a diamond saw and polished with SiC paper, and then placed directly in front of the external proton beam. It is not necessary to coat the sample surface with a conductive layer as the charges are dissipated in air and helium. Step width of the concentration profiles is determined by precisely recorded sample translation in front of the beam. The above experimental conditions were used for F analysis in archaeological bone materials in the applications described in this chapter. 

Sampling. Pottery (207 pieces) was analyzed in this project. Samples varied in size from 25 to 500 mg. Individual samples were cut with a diamond saw or were broken from their parent sherd. The outer surfaces of each sample were removed with a carborundum bit. After cleaning, the samples were weighed and stored in polyethylene vials. 

The product ceramic in each case appeared to be a very hard monolith, with dense phases separated by large pores. The top portion of each monolith was covered with a thin soft layer of acid phase that precipitated during heating. When this layer was sliced off using a diamond saw, the samples did not dissolve in water, nor did they lose any significant weight when soaked in water for several days. Also, the pH of the water remained near neutral indicating lack of any soluble acid phosphates. 

The rocking-curve method has been applied to semiconductor materials by several workers. Weissmann(8) estimated 5ft as the depth of damage on germanium lapped with No. 305 abrasive (3200 mesh alundum, having nominal particle size of 5fi). On silicon Andrus and Bond (9) found l/2ft depth for a fine polish, 3ft for No. 305 lap, and 10ft for a diamond saw-cut the widths at half-maximum intensity before any etching were 13<... 

The material can be tooled with diamond saws and ultrasonic drilling machines... 

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