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Current cutoff

Fig. 13.2. Dependence of tip radius of curvature with cutoff time. Scanning electron micrographs of tips with different etching-current cutoff time, (a) 600 ns, with an average radius of curvature 32 nm. (b) 140 ms, with an average radius of curvature 58 nm. (c) 640 ms, with an average radius of curvature lOOnm. (reproduced from ibe et al., 1990, with permission.)... Fig. 13.2. Dependence of tip radius of curvature with cutoff time. Scanning electron micrographs of tips with different etching-current cutoff time, (a) 600 ns, with an average radius of curvature 32 nm. (b) 140 ms, with an average radius of curvature 58 nm. (c) 640 ms, with an average radius of curvature lOOnm. (reproduced from ibe et al., 1990, with permission.)...
REGION 1 Collector current cutoff, or collector voltage saturation... [Pg.542]

The use of electrodeposition to apply paint is a comparatively recent innovation. The history of this development has been detailed by Brewer (2, ). The electrodeposition of paint, or electrocoating as it is commonly labeled, is derived from the old rubber latex technology and has many features in common but it differs in one important respect-- it provides rapid and complete current cutoff. [Pg.276]

Figure 4. Current-time curves illustrating the effect of emulsifier structure on current cutoff. (A) p-nitrooenzyl-methyldodecylsulfonium chloride (B) p-fiuorobenzyldi-methyldodecylammonium chloride. Figure 4. Current-time curves illustrating the effect of emulsifier structure on current cutoff. (A) p-nitrooenzyl-methyldodecylsulfonium chloride (B) p-fiuorobenzyldi-methyldodecylammonium chloride.
Figure 5. Effect of metal substrate on current cutoff. Latex stabilized by N(m-trifluoromethylbenzyl)-N-dodecyl-Fl,Fl-dimethyUimmonium chloride. = —1.64 V (A) platinum (B) cold rolled steel (C) copper (soft sheet). Curves B and C displaced 3 and 6 sec, respectively. Figure 5. Effect of metal substrate on current cutoff. Latex stabilized by N(m-trifluoromethylbenzyl)-N-dodecyl-Fl,Fl-dimethyUimmonium chloride. = —1.64 V (A) platinum (B) cold rolled steel (C) copper (soft sheet). Curves B and C displaced 3 and 6 sec, respectively.
Electrodeposition experiments were carried out in the apparatus described earlier (4). The equipment is illustrated schematically in Figure 2. The circuit also included a strip chart recorder and integrator. A variety of metals were coated at the cathode using the standard condition of 200 V for 2 min. The cathode area was held constant at 7.3 cm, unless otherwise specified. After deposition, the metal test pieces were rinsed with deionized water, dried and weighed to determine the amount of polymer deposited. The number of coulombs was measured simultaneously in order to calculate current efficiencies. Results were analyzed and compiled in a simple computer program. A typical printout is shown below for a system with poor current cutoff (Table V ), and good cutoff (Table VI). The set of metals used as substrate are listed below. [Pg.294]

Protective potentials are generally -0.85 V to a copper/copper sulfate cell and -0.80 V to a silver/silver chloride cell. (Dther criteria, such as an electronegative shift of 300 mV or polarization with a potential shift of no more than 100 mV upon current cutoff are also used. National Association of Corrosion Engineers (NACE) standards that cover these criteria are available. [Pg.134]

HgCdTe photodiode performance for the most part depends on high quantum efficiency and low dark current density (83,84) as expressed by equations 23 and 25. Typical values of at 77 K ate shown as a function of cutoff wavelength in Figure 16 (70). HgCdTe diodes sensitive out to a wavelength of 10.5 p.m have shown ideal diffusion current limitation down to 50 K. Values of have exceeded 1 x 10 . Spectral sensitivities for... [Pg.435]

The MOSEET has three regions of operation. The cutoff region occurs for V g < Up. In this region, the drain-to-source current is the reverse saturation current of the back-to-back source and drain junctions. This leakage current is small but nonzero and allows charge to leak off capacitors which are isolated by cutoff MOSFETs. Because this is how bits are stored in dynamic memory (DRAM) ceUs, DRAMs must be regularly refreshed to retain their memory. [Pg.352]

The first circuit that can burn up a significant amount of power is the startup circuit. Here dc current is taken from the input voltage so that the control IC and driver circuits have enough power to start the power supply. If the type of start-up circuit does not cutoff its current flow after a successful start-up has been done, then up to 3 W can be continuously dissipated within the circuit depending upon the input voltage. [Pg.139]

MD simulations in expHcit solvents are stiU beyond the scope of the current computational power for screening of a large number of molecules. However, mining powerful quantum chemical parameters to predict log P via this approach remains a challenging task. QikProp [42] is based on a study [3] which used Monte Carlo simulations to calculate 11 parameters, including solute-solvent energies, solute dipole moment, number of solute-solvent interactions at different cutoff values, number of H-bond donors and acceptors (HBDN and HBAQ and some of their variations. These parameters made it possible to estimate a number of free energies of solvation of chemicals in hexadecane, octanol, water as well as octanol-water distribution coefficients. The equation calculated for the octanol-water coefficient is ... [Pg.389]

After the initial inventory reporting cutoff in May of 1978, this retrospective approach was replaced with the flow of current information. New substances, as they became commercial, had to be identified and put through a decision process as shown in Figure 2. New reports were again necessitated by the commercialization of a new substance. Since July of 1979. Section 5 Compliance has been the source of nearly all compliance activity. Input for Premanufacture Notification purposes now takes a shape similar to that previously indicated, (see Figure 2) but now incoming new product material must reach the coordinator earlier in the life of the product than at any other time in the compliance effort. This introduced a potential time delay in the commercialization process. [Pg.144]


See other pages where Current cutoff is mentioned: [Pg.542]    [Pg.278]    [Pg.283]    [Pg.290]    [Pg.1325]    [Pg.2161]    [Pg.378]    [Pg.588]    [Pg.134]    [Pg.793]    [Pg.542]    [Pg.278]    [Pg.283]    [Pg.290]    [Pg.1325]    [Pg.2161]    [Pg.378]    [Pg.588]    [Pg.134]    [Pg.793]    [Pg.220]    [Pg.435]    [Pg.515]    [Pg.552]    [Pg.360]    [Pg.27]    [Pg.96]    [Pg.348]    [Pg.135]    [Pg.123]    [Pg.125]    [Pg.197]    [Pg.711]    [Pg.174]    [Pg.8]    [Pg.334]    [Pg.79]    [Pg.20]    [Pg.153]    [Pg.154]    [Pg.324]    [Pg.207]    [Pg.9]    [Pg.40]    [Pg.102]    [Pg.131]    [Pg.373]   
See also in sourсe #XX -- [ Pg.284 , Pg.288 ]




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