Thermal conductivity copper

A simple 2D simulation has been performed using COMSOL 4.2a, to model a cast cooler as shown in Figure 5. Copper with 80% of the theoretical copper thermal conductivity, i.e. k = 320 W/m K, has been used to simulated phosphorus deoxidized copper. The copper cooler shown in Figure 5 is equipped with dove-tail grooves containing refractory with a A = 1.8 W/m K. A heat flux of 1 MW/m has been applied to the hot face, by manipulating the hot face temperature (set to 1100 C). It can be seen that the sharp tips of the copper at the hot face are at incipient melting and are well above the recommended 400 maximum copper hot face temperature for continuous cooler operation without oxidation [41]. 

The heat pipe has properties of iaterest to equipmeat desigaers. Oae is the teadeacy to assume a aeady isothermal coaditioa while carrying useful quantities of thermal power. A typical heat pipe may require as Htfle as one thousandth the temperature differential needed by a copper rod to transfer a given amount of power between two poiats. Eor example, whea a heat pipe and a copper rod of the same diameter and length are heated to the same iaput temperature (ca 750°C) and allowed to dissipate the power ia the air by radiatioa and natural convection, the temperature differential along the rod is 27°C and the power flow is 75 W. The heat pipe temperature differential was less than 1°C the power was 300 W. That is, the ratio of effective thermal conductance is ca 1200 1. 

The interelectrode insulators, an integral part of the electrode wall stmcture, are required to stand off interelectrode voltages and resist attack by slag. Well cooled, by contact with neighboring copper electrodes, thin insulators have proven to be very effective, particularly those made of alumina or boron nitride. Alumina is cheaper and also provides good anchoring points for the slag layer. Boron nitride has superior thermal conductivity and thermal shock resistance. 

In appUcations in which electrical conductivity is required, metals, copper, tungsten, molybdenum, and Kovar [12606-16-5] are the preferred chip-carrier materials. Metals have exceUent thermal conductivities. Tables 2 and 3 Ust the various materials used for substrates, along with their mechanical, electrical, and thermal properties. 

Copper is universally used as the metal plating for tape because it can be easily laminated with copper and the various plastic tapes. Copper is readily etched and has excellent electrical and thermal conductivity in both electrodeposited and roUed-annealed form. The tape metal plating is normally gold- or tin-plated to ensure good bondabiUty during inner- and outer-lead bonding operations and to provide better shelf life and corrosion resistance. 

Copper is by far the most widely used conductor material. It has high electrical conductivity, thermal conductivity, solderabiUty, and resistance to corrosion, wear, and fatigue. Annealed copper conductors can withstand flex and vibration stresses normally encountered in use. 

A 99.5% Cu—0.5% Te alloy has been on the market for many years (78). The most widely used is alloy No. CA145 (number given by Copper Development Association, New York), nominally containing 0.5% tellurium and 0.008% phosphorous. The electrical conductivity of this alloy, in the aimealed state, is 90—98%, and the thermal conductivity 91.5—94.5% that of the tough-pitch grade of copper. The machinahility rating, 80—90, compares with 100 for free-cutting brass and 20 for pure copper. 

BeryUia ceramics offer the advantages of a unique combination of high thermal conductivity and heat capacity with high electrical resistivity (9). Thermal conductivity equals that of most metals at room temperature, beryUia has a thermal conductivity above that of pure aluminum and 75% that of copper. Properties Ulustrating the utUity of beryUia ceramics are shown in Table 2. 

The high electrical and thermal conductivities and corrosion resistance of copper combined with its workabiUty give the metal its very wide range of commercial appHcations. Unlike most metals, which are alloyed with other elements to enhance properties, for example, alloy steel and aluminum, copper is primarily used in its pure, unalloyed form. 

Copper is primarily alloyed to increase strength, however, electrical and thermal conductivities, corrosion resistance, formabiUty, and color are also strongly affected by alloying. Elements typically added to copper are 2inc, tin, nickel, iron, aluminum, siUcon, chromium, and beryUium. 

Electrical—Thermal Conductivities. Electrical conductivities of alloys (Table 5) are often expressed as a percentage relative to an International Annealed Copper Standard (lACS), ie, units of % lACS, where the value of 100 % lACS is assigned to pure copper having a measured resistivity value of 0.017241 Q mm /m. The measurement of resistivity and its conversion to % lACS is covered under ASTM B193 (8). 

Copper and its alloys also have relatively good thermal conductivity, which accounts for thek appHcation where heat removal is important, such as for heat sinks, condensers, and heat exchanger tubes (see Heatexchangetechnology). Thermal conductivity and electrical conductivity depend similarly on composition primarily because the conduction electrons carry some of the thermal energy. 

To a good approximation, thermal conductivity at room temperature is linearly related to electrical conductivity through the Wiedemann-Eran2 rule. This relationship is dependent on temperature, however, because the temperature variations of the thermal and the electrical conductivities are not the same. At temperatures above room temperature, thermal conductivity of pure copper decreases more slowly than does electrical conductivity. Eor many copper alloys the thermal conductivity increases, whereas electrical conductivity decreases with temperature above ambient. The relationship at room temperature between thermal and electrical conductivity for moderate to high conductivity alloys is illustrated in Eigure 5. 

Eig. 5. The Wiedemann-Eran2 relationship at 20°C between electrical and thermal conductivities of copper alloys having moderate to high conductivities. 

The thermal conductivity of copper having an electrical conductivity of 100% lACS is 391 W/ (m-K) at 20°C. The Wiedemann-Eranz ratio of thermal conductivity and the product of electrical conductivity times absolute temperature are approximately constant. Many copper alloys have increasing thermal conductivity with increase in temperature, whereas electrical conductivity decreases. 

Electrical conductivity is comparatively easy to measure, whereas thermal conductivity is not. Electrical conductivity values for the important cast alloys are Hsted in Table 2. Eigure 1 schematically shows the electrical conductivity of cast copper-base alloys compared with various other cast metals and alloys. The equation Y = 4.184 + 3.93a gives an approximation of thermal conductivity in relation to electrical conductivity, where Tis in W/(m-K) at 20°C and X is the % lACS at 20°C. 

Aluminum and Alloys Aluminum and its alloys are made in practically all the forms in which metals are produced, including castings. Thermal conductivity of aluminum is 60 percent of that of pure copper, and unalloyed aluminum is used in many heat-transfer applications. Its high electrical conductivity makes aluminum popular in electrical apphcations. Aluminum is one of the most workable of metals, and it is usually joined by inert-gas-shielded arc-welding techniques. 

Copper and Alloys Copper and its alloys are widely used in chemical processing, particulany when heat and electrical conductivity are important fac tors. The thermal conductivity of copper is twice that of aluminum and 90 percent that of silver. A large number of cop-... 

Since the higher thermal conductivity material (copper or bronze) is a much better bearing material than the conventional steel backing, it is possible to reduce the babbitt thickness to. 010-.030 of an inch (.254-.762 mm). Embedded thermocouples and RTDs will signal distress in the bearing if properly positioned. Temperature monitoring systems have been found to be more accurate than axial position indicators, which tend to have linearity problems at high temperatures. 

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