Structure types copper-gold

Corrosion by dealloying is common in brasses here the zinc component of the alloy is preferentially removed. Brasses with high proportions of the P phase are especially prone to this type of attack. The mechanism appears to be corrosion of both copper and zinc from the metal the zinc passes into solution but the copper is re-deposited with a porous structure of low strength. Aluminium bronzes also suffer dealloying of the aluminium component if incorrectly heat treated. Other metals which may be preferentially dissolved from their alloys are manganese from copper-manganese, nickel from copper-nickel, copper from either copper-silver or copper-gold, and tin from tin-lead (solders). It is evident from this list that it is the component which is anodic to the alloy which is removed. 

Not all materials are so well behaved. For example, many metal alloys have considerable composition ranges and a correct calculation of the intensities of diffracted beams needs inclusion of a site occupancy factor. For example, the disordered gold-copper alloy Au Cu, is able to take compositions with x varying from 1, pure gold, to 0, pure copper. The structure of the alloy is the copper (Al) structure, (see Chapter 1), but in the alloy the sites occupied by the metal atoms contain a mixture of Cu and Au, (Figure 8.1). This situation can be described by giving a site occupancy factor to each type of atom. For example,... 

Non-platinum metal complexes with antitumour activity in murine screens are known for a wide diversity of structural types and the transition metals most studied include rhodium, ruthenium, gold, copper and titanium. The spectrum of activity is generally different to cisplatin (Ti, Au) and in some cases the complexes show lack of cross-resistance with cisplatin-resistant lines. 

Even when complete miscibility is possible in the solid state, ordered structures will be favored at suitable compositions if the atoms have different sizes. For example copper atoms are smaller than gold atoms (radii 127.8 and 144.2 pm) copper and gold form mixed crystals of any composition, but ordered alloys are formed with the compositions AuCu and AuCu3 (Fig. 15.1). The degree of order is temperature dependent with increasing temperatures the order decreases continuously. Therefore, there is no phase transition with a well-defined transition temperature. This can be seen in the temperature dependence of the specific heat (Fig. 15.2). Because of the form of the curve, this kind of order-disorder transformation is also called a A type transformation it is observed in many solid-state transformations. 

Grain size varies widely, from 10 to 5000 nm. The grain size of fine-grained or banded deposits is usually 10—100 nm. Some metals, notably copper, nickel, cobalt and gold, can be deposited in all four types of grain structure, depending on the solution composition and plating conditions. 

Scientists have been interested in bimetallic systems as catalysts for many years. For a decade or longer beginning shortly after World War II, much attention was devoted to the use of metal alloys as catalysts to probe the relationship between the catalytic activity of a metal and its electronic structure (1-4). One type of alloy which was investigated extensively consisted of a Croup VIII and a Group IB metal, for instance, nickel-copper or palladium-gold. 

The cubic closed ABC type packing (ccp) or cubic face centered structure is realized in nature by metals like gold, silver, copper, lead, aluminum, nickel and many other metals based on the importance of the metal copper, it is called the Copper Type (see Fig. 5.6). 

The process for the thennal sensor network is as follows. Organic diodes, to be used as sheet-type thermal sensors, are manufactured on an ITO-coated PEN film. A 30-mn thick p-type semiconductor of copper phthalocyanine (CuPc) and a 50-nm thick n-type semiconductor of 3,4,9,10-perylene-tetracarboxylic-diimide (PTCDI) are deposited by vacuum sublimation. A 150-mn thick gold film is then deposited to form cathode electrodes having an area of 0.19 mm. The film with the organic diodes is coated with a 2-pm thick parylene layer and the electronic interconnections are made by the method similar to that mentioned before. The diode film is also mechanically processed to form net-shaped structures. Finally, to complete the thermal sensor network, we laminated the transistor and diode net films together with silver paste patterned by a microdispenser. This is shown in Figure 6.3.11. 

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