Controlled collapse chip connection

An exhaustive discussion of wire-bond, TAB, and controlled-collapse chip connection (C4) or solder-bumped flip-chip-to-board interconnect technology can be fonnd in Chap. 6 of Ref. 7. Figure 3.15 illustrates these chip interconnect methodologies, which will be discussed in the following text. 

Tape automated bonding (TAB) and controlled collapse chip connection (C4) are two other common first-level packaging technologies that allow increased I/O density compared with wirebonding in molded plastic packages. In TAB, chips are thermocompression bonded to the inside ends of radially patterned metal leads on pol5uner tape. The outside ends of the leads are then soldered to a second-level package and the chip is covered with an encapsulant. 

C4NP controlled collapse chip connection new process... 

Howard, R.T. Optimization of indium-lead alloys for controlled collapse chip connection application. IBM J. Res. Develop. 1982, 26, 372-378. 

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