Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Column grid array

Ceramic column grid array (CCGA), invented by lEM, where solder columns replace the solder balls. [Pg.859]

J. Lau, T. Castello, D. Shangguan, W. Dauksher, J. Smetana, R. Horsley, D. Love, I. Memis, and B. Sullivan, Failure Analysis of Lead-Free Solder Joints for a 1657 CCGA (Ceramic Column Grid Array) Package, Proceedings of MAPS 2004, Nov 2004... [Pg.27]

A. Perkins, and S.K. Sitaraman, Vibration-Induced Solder Joint Failure of a Ceramic Column Grid Array (CCGA) Package, 54th Electronic Components and Technology Conference, June 2004, p 1271-1278... [Pg.197]

CCGA ceramic column grid array OEM original equipment manufacturer... [Pg.282]

FIG. 9 Illustration depicting typical ball and column grid array terminations. [Pg.32]

FIG. 79 Ceramic column grid array (CCGA) configurations, a) Single melt eutectic Pb-Sn fillet, b) cast column with eutectic Pb-Sn on card pad, c) column last attach solder process (CLASP) with Pd-doped solder on chip-carrier pad and eutectic Pb-Sn fillet on card pad. [Pg.647]

FIG. 81 Annealed copper column grid arrays (CuCG As) in a corner location after 4370 cycles at 0 to 100°C. (From Ref. 41.)... [Pg.649]

TABLE 15 Chip Carrier and Printed Circuit Board Attributes Utilized in Thermal Fatigue Testing of the Copper Column Grid Arrays... [Pg.650]

TABLE 16 Summary of Copper Column Grid Array Thermal Fatigue Data from Thermal Cycling atOto 100°C, 2cph... [Pg.651]

IBM developed and qualified a lead-free column grid array solution that delivers equivalent electrical performance and a superior lifetime compared to the standard tin-lead technology. The qualification of the lead-free technology supports the manufacturing conditions of 1 x column rework with up to two hot oil submersions for column removal. The CuCGA solution can be customized to support various specific application requirements. [Pg.651]

Master, Raj, et al. Ceramic column grid array for flip chip applications. Proc. 45th Electrical Components and Technology Conference IEEE Las Vegas, NV, 1995 925 929 pp. [Pg.664]

Ray, Sudipta, et al. Ceramic column grid array for a high performance workstation application. Proc. 47th Electrical Components and Technology Conference IEEE San Jose, CA, 1997 319 324. Ray, Sudipta, et al. CLASP ceramic column grid array technology for ceramic chip carriers. Proc. Semicon West, San Jose, CA, July 1999. [Pg.664]

Interrante, Mario et al. High Density Column Grid Array Connections and Method Thereof, U.S. Patent 6,429,388, 2002. [Pg.664]

See other pages where Column grid array is mentioned: [Pg.32]    [Pg.47]    [Pg.924]    [Pg.1061]    [Pg.1085]    [Pg.1138]    [Pg.199]    [Pg.233]    [Pg.10]    [Pg.11]    [Pg.32]    [Pg.32]    [Pg.536]    [Pg.646]    [Pg.1021]   
See also in sourсe #XX -- [ Pg.10 ]



SEARCH



Ceramic column grid array

© 2024 chempedia.info