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Ceramic column grid array

Ceramic column grid array (CCGA), invented by lEM, where solder columns replace the solder balls. [Pg.859]

J. Lau, T. Castello, D. Shangguan, W. Dauksher, J. Smetana, R. Horsley, D. Love, I. Memis, and B. Sullivan, Failure Analysis of Lead-Free Solder Joints for a 1657 CCGA (Ceramic Column Grid Array) Package, Proceedings of MAPS 2004, Nov 2004... [Pg.27]

A. Perkins, and S.K. Sitaraman, Vibration-Induced Solder Joint Failure of a Ceramic Column Grid Array (CCGA) Package, 54th Electronic Components and Technology Conference, June 2004, p 1271-1278... [Pg.197]

CCGA ceramic column grid array OEM original equipment manufacturer... [Pg.282]

FIG. 79 Ceramic column grid array (CCGA) configurations, a) Single melt eutectic Pb-Sn fillet, b) cast column with eutectic Pb-Sn on card pad, c) column last attach solder process (CLASP) with Pd-doped solder on chip-carrier pad and eutectic Pb-Sn fillet on card pad. [Pg.647]

Master, Raj, et al. Ceramic column grid array for flip chip applications. Proc. 45th Electrical Components and Technology Conference IEEE Las Vegas, NV, 1995 925 929 pp. [Pg.664]

Ray, Sudipta, et al. Ceramic column grid array for a high performance workstation application. Proc. 47th Electrical Components and Technology Conference IEEE San Jose, CA, 1997 319 324. Ray, Sudipta, et al. CLASP ceramic column grid array technology for ceramic chip carriers. Proc. Semicon West, San Jose, CA, July 1999. [Pg.664]

See other pages where Ceramic column grid array is mentioned: [Pg.32]    [Pg.47]    [Pg.924]    [Pg.1061]    [Pg.1085]    [Pg.1138]    [Pg.233]    [Pg.646]    [Pg.32]    [Pg.47]    [Pg.924]    [Pg.1061]    [Pg.1085]    [Pg.1138]    [Pg.233]    [Pg.646]    [Pg.1040]    [Pg.1366]    [Pg.1368]    [Pg.536]    [Pg.1021]    [Pg.352]    [Pg.246]   
See also in sourсe #XX -- [ Pg.233 ]



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