Chip-Scale Packages CSP

Amagai M, Sano H, Maeda T, Imura T, Saito T (1997) Development of chip scale packages (CSP) for center pad devices. Proc Electron Compon Technol Conf 47th,pp 343-352... 

Bare die such as integrated circuits may be assembled in plastic or ceramic carriers whose dimensions are slightly larger than the chip. These are called chip-scale packages (CSP) and are defined as packages that are no larger than 1.5 times the area of the die or no more than 1.2 times the width or length of the die. If the... 

To meet the needs for a finer-pitch circuit board technology for ball grid array (BGA) packages, chip-scale packages (CSPs), and high-density circuit cards, a new circuit board... 

FIGURE 17.6 The effective of a 12 x 12 mm Chip scale package (CSP) with 49 thermal balls as a function of the (x,y) length of a continuous thermal plane under the package.Two trace lengths were assumed, showing different amounts of coupling of heat from the traces into the plane. 

To enable new area-array components, such as chip scale packages (CSPs), micro-BGA, and flip-chip interposers... 

In mobile phone applications, where chip scale packages (CSPs) are commonly employed, low-CTE non-woven aramid reinforcement extends solder joint life as much as three times over FR-4 and resin-coated foil (RCF). After more than 1,000 thermal cycles ( 0 to -tl25°C), non-woven aramid-reinforced epoxy resin does not crack, as is common with nonreinforced dielectrics. 

Laser is a recent innovation in rework and repair. The fundamentals of laser for initial soldering or for repair have already been discussed in Chap. 47. In the commercial incarnation of this technique, a laser beam is quickly scanned around component leads or, package surface, in the case of area-array devices such as EGAs and chip-scale packages (CSPs). It is most effective for plastic packaged components rather than the thermally massive CBGAs, CCGAs, and so on. In this technique, the component body is heated. Otherwise, there is little difference between this and alternative rework or repair techniques. 

Inabihty to see hidden solder joints in component types such as some connectors, PGAs, EGAs, chip-scale packages (CSPs), SIPs, or multichip modules (MCM)... 

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