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Chip integration

P.A. Hammond and D.R.S. Cumming, Performance and system-on-chip integration of an unmodified CMOS ISFET. Sens. Actuators B. 111-112, 254-258 (2005). [Pg.323]

Banerjee, K. Souri, S. J. Kapur, P. Saraswat, K. C. 2001. 3-D ICs A novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration. Proc. IEEE 89 602-633. [Pg.443]

Fig. 15.25 A schematic diagram for MCLW sensor chip integrated with electric field. Reprinted from Ref. 22 with permission. 2008 The Royal Society of Chemistry... Fig. 15.25 A schematic diagram for MCLW sensor chip integrated with electric field. Reprinted from Ref. 22 with permission. 2008 The Royal Society of Chemistry...
Ultra-high Q-factors (10 -9x10 ) large mode volumes dense modal spectrum (all modes are degenerate) challenging on-chip integration... [Pg.41]

Mode volumes lower than for spheres very high Q-factors (5 x 10 ) reduced azimuthalmode spectrum suitable for on-chip integration... [Pg.41]

The elements Si and Ge of group 14 act as semiconductors. A semiconductor is an element that can, to some extent, conduct electricity and heat, meaning it has the properties of both metal and nonmetals. The abihty of semiconductors to transmit variable electrical currents can be enhanced by controlling the type and amount of impurities. This is what makes them act as on-ofF circuits to control electrical impulses. This property is valuable in the electronics industry for the production of transistors, computer chips, integrated circuits, and so on. In other words, how well a semiconductor conducts electricity is not entirely dependent on the pure element itself, but also depends on the degree of its impurities and how they are controlled. [Pg.189]

J. Wang, A. Ibanez and M.P. Chatrathi, On-Chip integration of enzyme and immunoassays Simultaneous measurements of insulin and glucose, J. Am. Chem. Soc., 125 (2003) 8444-8445. [Pg.870]

Planar resonators and microstrip and coplanar transmission lines represent the passive elements in almost any integrated circuit technology at first, on chip integration in socalled mmics (monolithic microwave integrated circuits) with SiGe or m/v semiconducting active... [Pg.114]

FIGURE 7.7 Cross-sectional view of a microchemical chip integrated with some optical components, (a) The microchemical chip showing the microlens (entrance and exit), the 3000-A Cr aperture layers (entrance and exit), and microchannel (25 pm deep) (b) the microchemical chip together with the pinhole (800 pm) and interference filter for detection by the photodetector [688]. Reprinted with permission from the American Chemical Society. [Pg.194]

FIGURE 8.15 Cross section of the fight-addressable potentiometer sensor (LAPS) chip integrated with a flow channel for study of adherent cells [848]. Reprinted with permission from the Institute of Electrical Engineers of lapan. [Pg.263]

Hisamoto, H., Horiuchi, T., Tokeshi, M., Hibara, A., Kitamori, T., On-chip integration of neutral ionophore-based ion pair extraction reaction. Anal. Chem. 2001, 73(6), 1382-1386. [Pg.428]

Fig. 12 Lab-on-chip integration and application of arrays of nanohole arrays (a) Schematic of device at range of relevant lengthscales (b) Schematic of optical and fluidic setup with an image of the device (c) Image showing six cross-stream nanohole sensors across a cross-stream microfluidic concentration gradient and (d) Results of on-chip biosensing test. Reprinted with permission from the American Chemical Society [67]... Fig. 12 Lab-on-chip integration and application of arrays of nanohole arrays (a) Schematic of device at range of relevant lengthscales (b) Schematic of optical and fluidic setup with an image of the device (c) Image showing six cross-stream nanohole sensors across a cross-stream microfluidic concentration gradient and (d) Results of on-chip biosensing test. Reprinted with permission from the American Chemical Society [67]...
Topper M, Scherpinski K, Sporle H-P, Landesberger C, Ehrmann O, Reichel H. Thin chip integration (TCI-Modules) — a novel technique for manufacturing three dimensional IC-packages. Proc Int Symp Microelectr, SPIE 2000 4339 208-211. [Pg.462]

Current standard of data transfer rate is tens gigahertz per channel. Design and integration of such rapid optical modulators is one of the most important goals of the recent years. A number of ultrafast all-optieal and electro-optical devices [1-3] have been proposed to date. However, due to high energy consumption and dissipation, complexity of production process and on-chip integration, none of these devices is used extensively. [Pg.581]

Fig. 5.18. A scheme for lab-on-a-chip integration including interferometric optical biosensors, lasers, photodetectors and CMOS electronics. Fig. 5.18. A scheme for lab-on-a-chip integration including interferometric optical biosensors, lasers, photodetectors and CMOS electronics.
Among the attributes of microchip electrophoresis separations, the most notable is high speed—normally fourfold to tenfold faster than conventional CE and at least an order of magnitude faster than the slab gel format. Other advantages of microchips include simplicity, capabilities for chip integration of multiple functions, and certainly the potential for automation. [Pg.135]


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See also in sourсe #XX -- [ Pg.234 ]




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