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Chemical mechanical planarization future

Baneijee, G., Rhoades, R.L., 2008. Chemical mechanical planarization historical review and future direction. ECS Trans. 13, 1—19. [Pg.84]

Moinpour, M., 2007. Current and future challenges in CMP materials. In Li, Y. (Ed.), Microelectronic Applications of Chemical Mechanical Planarization. Wiley Interscience, pp. 25—56. [Pg.415]

Chemical mechanical polishing (CMP) is a final major manufacturing step extensively used in semiconductor fabrication for flattening semiconductor wafers to obtain a mirror surface finish. In 2011, the CMP pad market yielded 626 million while the slurry market totaled 1.0 billion, and is forecasted to grow 7.0% in 2012 and exceed 1.3 billion by 2016 [1]. CMP is still considered the leading planarization technology for current and future manufacturing [2]. [Pg.327]

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See also in sourсe #XX -- [ Pg.3 ]



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