Bonding materials, adhesive characterization, application

W. L. Baun, Applications of ion beaih methods to characterization of adhesive bonding materials, in Interfacial Applications of Surf ace Analysis (L. A. Casper and C. J. Powell, eds.), pp. 121-141, American Chemical Society, Washington (1982). 

Applications of Ion Beam Methods to Characterization of Adhesive Bonding Materials... 

The fracture-based approach derives from continuum fracture mechanics theory, which claims the strength of most real solids is governed by flaws within the material [2]. To help predict this type of behavior, many test methods have been developed to determine fracture properties of adhesives. These tests are used to characterize the mode I, II, and III fracture properties of many types of material systems. In this study, the focus will be on the mode I and II characteristics of bonded joints for automotive applications. 

Sound knowledge of the joint behavior is required for a successful design of bonded joints. To characterize the bonded joint, the loading in the joint and the mechanical properties of the substrates and of the adhesives must be properly defined. The behavior of the bonded joint is investigated by finite element (FE) analysis methods. While for the design of large structures a cost-efficient modeling method is necessary, the nonlinear finite element methods with a hyperelastic material model are required for the detailed joint analysis. Our experience of joint analysis is presented below, and compared with test results for mass transportation applications. 

The outline of this chapter is as follows. The spectroscopic techniques that can be used for surface of interface characterization of adhesively bonded materials are listed in Table 1. The most popular techniques are then discussed briefly in terms of the type of information they provide and where they can be applied. Their limitations are also described briefly. Since just a handful of techniques are used on a regular basis, notably XPS, AES, SIMS, FTIR, and Raman spectroscopy, only these techniques will be discussed in detail. Recent and ongoing instrumental developments are described and specific applications of each of these techniques are presented and discussed. Finally, a bibliography containing many references to textbooks and important artieles is given. 

The aim of this book is to explain in a simple yet complete manner all that is required to successfiilly bond different materials. This book is both a reference and a source for learning the basics for those involved in the entire product value chains. Basic principles of adhesion such as surface characterization, types of adhesive bonds, and adhesion failure topics have been covered in addition to a description of common adhesive materials and application techniques. This book offers information helpful to engineers, chemists, students, and aU others involved in selecting adhesives and bonding materials together. 

All adhesives are polymers, and they are used in many ways, for example in composites, automotive tire cords, ply yood, tapes and labels. A particularly demanding application is the cementing of metal joints in military aircraft with polymers such as epoxy resins. The interfaces in such materials must be characterized to determine the strength of the adhesive bond and the relation of such properties as peel strength with... 

Work in our laboratory in the past few years has been concerned with the use of acetylene chemistry, both to aid the processing of aromatic heterocyclic polymers and to pro-, vide such materials a method by which they could become tougher and more durable in structural applications. The most attractive feature of the acetylenic carbon carbon triple bond is its capability to undergo various ionic and free radical addition reactions, leading to highly fused thermally stable aromatic systems. This paper will review our work on acety-lene containing aromatic heterocyclic polymers with respect to synthesis and characterization, as well as some already determined mechanical properties as composites and adhesives. 

Abstract This chapter gives a brief description of special mechanical tests for various types of materials and sample geometries, such as blister tests for membranes/adhesives/coatings, tensile tests and shear tests for sealants/foam adhesives, indentation and scratch tests for coatings, tack tests for pressure-sensitive adhesives (PSAs), and bimaterial curvature tests for characterizing residual stress, stress-free temperature (SFT), and coefficient of thermal expansion (CTE) of adhesives bonded to substrates of interest. In addition, some applications of these tests, including the nano-/micrometric scale, are also described in this chapter. 

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