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Bonding and Setting

Another consideration for proper application of fused cast basalt tile under chemical attack is the proper choice of the bonding and setting material. The type of mortar required will vary depending on the exposure and the operating conditions. Setting materials may include hydraulic mortars, silicates, resins, sulfur or mastics. [Pg.215]

Cartons from corrugated board are most often sealed with liquid glues or hot-melt adhesives. However, dextrin adhesives are still used as a result of their low cost and ready availability. Adhesives for sealing cartons must have low and stable viscosity, be able to form strong bonds, and set up quickly. If staining of the carton is not a concern, sodium hydroxide may be added to increase adhesion. A formulation for a white dextrin adhesive is given in Table 5. [Pg.504]

The complex dynamic and structural properties reveal the influence of SPEU on the molecular dynamics and structure of PHBV, by forming in-termolecular hydrogen bonds and setting up of energy and steric barriers to PHBV crystallization. In terms of design of new biomedical composites, results presented have a scientific and practical interest to describe their behavior at water-temperature exposure. [Pg.24]

In 2012, Waldmann and co-workers successfully developed the Cu(l)/ Fesulphos-catalyzed double 1,3-dipolar cycloadditiOTi of two different azomethine ylides with 1,4-henzoquinone as dipolarophile to construct stereochemically and structurally complex molecules that forms four carbon arbon bonds and sets eight steieocenters with high regio-, diastereo- and enantioselectivity in a one-pot tandem reaction (Scheme 14) [26],... [Pg.190]

In hydrothermal process, hot water under high temperature and pressure penetrates into the compact structure of biomass and hydrolyzes the lignin, hemicelluloses and celluloses by breaking the H-bond and set the constituents free (Taherzadeh and Karimi, 2008). Hydrothermal pre-treatment is... [Pg.389]

A simple example would be in a study of a diatomic molecule that in a Hartree-Fock calculation has a bonded cr orbital as the highest occupied MO (HOMO) and a a lowest unoccupied MO (LUMO). A CASSCF calculation would then use the two a electrons and set up four CSFs with single and double excitations from the HOMO into the a orbital. This allows the bond dissociation to be described correctly, with different amounts of the neutral atoms, ion pair, and bonded pair controlled by the Cl coefficients, with the optimal shapes of the orbitals also being found. For more complicated systems... [Pg.300]

In most common chiral molecules, chirality arises from chiral tetravalent atoms. A conformation-independent chirality code (CICC) was developed that encodes the molecular chirality originating from a chiral tetravalent atom [42], For more generality, a conformation-dependent chirality code (CDCC) is used [43]. CDCC ti cats a molecule as a rigid set of points (atoms) linked by bonds, and it accounts for chirality generated by chirality centers, chirality axes, or chirality planes. [Pg.420]

Th e off-diagonal elemen ts represen t the domman t effects of bonding and are set to be proportional to the overlap by a parameter dependent on the two atoms involved in the overlap,... [Pg.274]

At the top of File Segment 5-1 is a heat of fomiation information block. Two sums are listed One is a sum of nomial bond enthalpies for ethylene, and the other is a sum selected from a parameter set of stiainless bonds. Both sets of bond enthalpies have been empirically chosen. A group of molecules selected as nomial generates one parameter set, and a group supposed to be strainless is selected to generate a second set of str ainless bond enthalpies designated SBE in Eile Segment 5-1. The subject of parameterization has been treated in detail in Chapter 4. See Computer Projects 3-6 and 3-7 for the specific problem of bond enthalpies. [Pg.145]

J Chem. Phys., 52, 431 (1970)] is a relatively inexpensive one and can be used for calculations on quite large molecules. It is minimal in the sense of having the smallest number of functions per atom required to describe the occupied atomic orbitals of that atom. This is not exactly true, since one usually considers Is, 2s, and 2p, i.e., five functions, to construct a minimal basis set for Li and Be, for example, even though the 2p orbital is not occupied in these atoms. The 2sp (2s and 2p), 3sp, 4sp, 3d,. .., etc. orbitals are always lumped together as a shell , however. The minimal basis set thus consists of 1 function for H and He, 5 functions for Li to Ne, 9 functions for Na to Ar, 13 functions for Kand Ca, 18 functions for Sc to Kr,. .., etc. Because the minimal basis set is so small, it generally can not lead to quantitatively accurate results. It does, however, contain the essentials of chemical bonding and many useful qualitative results can be obtained. [Pg.255]

Free mono- and multilayer films may be adhesive- or extmsion-bonded in the laminating process. The bonding adhesive may be water- or solvent-based. Alternatively, a temperature-dependent polymer-based adhesive without solvent may be heated and set by cooling. In extmsion lamination, a film of a thermoplastic such as polyethylene is extmded as a bond between the two flat materials, which are brought together between a chilled and backup roU. [Pg.453]

Hot tack strength is the abiUty of a heat-seal layer to hold together while molten, before the seal cools and sets up. This is a technically important property which is difficult to measure reproducibly in the laboratory. Owing to the reinforcing effect of ionic bonding on melt strength, ionomer sealing layers provide superior performance in a wide spectmm of appHcations. [Pg.407]

Poly(viayl acetate) emulsions or hot-melt adhesives are typically used to form the manufacturer s or glue lap joiat of the box. The main criteria for the adhesive is that it provide a strong and tough final bond and that it set up quickly enough to allow fast box production speeds. Production rates ia excess of 240 boxes per minute are not uncommon ia the iadustry. [Pg.519]


See other pages where Bonding and Setting is mentioned: [Pg.77]    [Pg.1293]    [Pg.1293]    [Pg.505]    [Pg.138]    [Pg.2]    [Pg.297]    [Pg.77]    [Pg.1293]    [Pg.1293]    [Pg.505]    [Pg.138]    [Pg.2]    [Pg.297]    [Pg.2516]    [Pg.2980]    [Pg.53]    [Pg.105]    [Pg.354]    [Pg.494]    [Pg.584]    [Pg.255]    [Pg.107]    [Pg.174]    [Pg.246]    [Pg.447]    [Pg.477]    [Pg.479]    [Pg.663]    [Pg.730]    [Pg.89]    [Pg.173]    [Pg.179]    [Pg.295]    [Pg.2]    [Pg.152]    [Pg.325]    [Pg.339]    [Pg.452]    [Pg.184]    [Pg.65]    [Pg.459]    [Pg.248]   


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