Bonding agent application methods

Nonwovens The textile and paper industries are based on the two oldest (wet and dry) processes. Manufacturers of nonwovens for plastics draw on both. With the wet, there are basically two types namely the Fourdrinier and cylinder machine types that have been modified. In addition, two basic types exist for the process formation of the web and application of the bonding agent or system where mechanical carding of fibers is used. The particular equipment and method of operation to be used, with their many modifications, is influenced by desired requirements such as mechanical properties, softness, surface condition, tenacity, etc. There are certain t) es of so-called nonwoven fabric that are directly formed from short or chopped fiber as well as continuous filaments. They are produced by loosely compressing together fibers, yarns, rovings, etc. with or without a scrim cloth carrier assembled by mechanical, chemical, thermal, or solvent methods. Products of this type include melted and spun-bonded fabrics. 

EN 1799 Products and systems for the protection and repair of concrete structures. Test methods. Tests to measure the suitability of structural bonding agents for application to concrete surface. 

Bonding agents may be applied in a number of ways. To make an effective bond an even coat of the bonding system is required of the correct thickness. The method of application is not important provided that an even coat of correct thickness is applied. Methods of application are ... 

Plastics that are readily bonded with induction methods include aU grades of ABS, nylon, polyester, polyethylene, polypropylene, and polystyrene, as well as those materials often considered more difficult to bond such as acetals, modified polyphenylene oxide, and polycarbonate. Reinforced thermoplastics with filler levels up to 65 percent have been joined successfully. Many combinations of dissimilar materials can be bonded with induction welding processes. Table 8.5 shows compatible plastic combinations for electromagnetic adhesives. Thermoset and other nonmetallic substrates can also be elec-tromagnetically bonded. In these applications the bonding agent acts as a hot-melt adhesive. 

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