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BONDER

This new quantity Sv p, the negative of which De Bonder (1920) has called the affinity and given the symbol of a script A, is obviously the important thennodynamic fiinction for chemical equilibrium ... [Pg.362]

Tilney, L.G., Bonder, E.M., Coluccio, L.M., Moosekar, M.S. (1983). Actin from Thyone sperm assembles on only one end of an actin filament A behavior regulated by profilin. J. Cell Biol. 97, 112-124. [Pg.41]

Paint films were prepared by spraying the paint on Bonder panels. [Pg.233]

Elquipment Scribers saws, die bonders, molds presses. Other. [Pg.323]

Bonded alumina, carbon monoxide compatibility with, 5 4t Bonded solid-film lubricants, 15 248—251 Bonded strain gauge, 20 654 Bond energies, 11 828, 829t Bonderizing process, 16 214 Bond functionalities, in lignin, 15 6 Bonding ABS, 1 428... [Pg.112]

Schematic of the Si-nMEA fabrication process (a) sputter Au layer on double-side polished wafer (b) pattern Au layer with liftoff process (c) spincoat and cure a polyimide layer (d) perform the double-sided photolithography to pattern etch pits (e) etch Si in ICP-DRIE to form Au/Si electrode (f) dice the wafer into a single die (g) RIE etch the polyimide layer with a shadow mask to expose current collecting region (h) electroplate Pt black on Au layer (i) sandwich both electrodes with Nafion 112 in a hot-press bonder. (Reprinted from J. Yeom et al. Sensors Actuators B107 (2005) 882-891. With permission from Elsevier.)... Schematic of the Si-nMEA fabrication process (a) sputter Au layer on double-side polished wafer (b) pattern Au layer with liftoff process (c) spincoat and cure a polyimide layer (d) perform the double-sided photolithography to pattern etch pits (e) etch Si in ICP-DRIE to form Au/Si electrode (f) dice the wafer into a single die (g) RIE etch the polyimide layer with a shadow mask to expose current collecting region (h) electroplate Pt black on Au layer (i) sandwich both electrodes with Nafion 112 in a hot-press bonder. (Reprinted from J. Yeom et al. Sensors Actuators B107 (2005) 882-891. With permission from Elsevier.)...
Preparation of coatings as free films. The oligomeric esterdlols were mixed with the crosslinkers HMMM or polyfunctional isocyanate. The molar ratio esterdlol/HMMM was 2 1 leading to an OH/OCH3 ratio of 4 6. The OH/NCO ratio was 1 1. Some 1 wt% diethanolamine salt of p-toluene sulphonlc acid, respectively 0.2 wt% Dabco were used as catalyst. The coatings were applied to Bonder 101 plates which had been sprayed with a thin layer (1-2 pm) of teflon. [Pg.111]

Nevertheless we did a number of tests of our model coatings directly applied to Bonder 101 panels. The panels were given a standard scratch just below the metal surface after which they... [Pg.113]

Wordy In a paper published by Bonderic et al., experiments were described that led to similar results. [Pg.37]

It is clear to the reader that Bonderic et al. published a paper because of the in-line citation. It is also obvious that experiments were described in that paper.)... [Pg.37]

Bonderizing . A trade mark process for furnishing a corrosion-resisting base for paint finishes on steel, Al, Zn their alloys and die castings Refs 1)T.Lyman,Edit, "Metals Handbook, AmSoc for Metals,Cleveland(1948),733 2)CondChemDict... [Pg.241]

Bonder, B. and Wagner, M. (2001) Functional Performance in Older Adults (2nd edn). Philadelphia FA Davis Company. [Pg.205]

Importantly, H2 can bind in stable fashion to very electron-deficient metal centers, which are weak back bonders, nearly as well as to more electron-rich M that promote OA. Calculations show that for highly electrophilic M the reduction in back donation is almost completely... [Pg.130]

Michael J. Bonder, Yunhe Huang, and George C. Hadjipanayis... [Pg.183]


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See also in sourсe #XX -- [ Pg.190 ]




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Adhesive bonder

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