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Board, boards composite

Phenohc/adhesives adhesives / sealants / gaskets abrasives and break pad binders printed circuit boards stmctural composites /laminates Metal/glass binders metal oxide binders retroreflective coatings glass optical coatings Hard copy printing inks toners... [Pg.454]

Fig. 2. Multilayer printed circuit board composite. Constmction is multiple layers of epoxy—glass and foil copper. Foil copper outermost layer and drilled through-holes are sequentially plated with electroless copper, electrolytic copper, electroless nickel, and electroless gold. Fig. 2. Multilayer printed circuit board composite. Constmction is multiple layers of epoxy—glass and foil copper. Foil copper outermost layer and drilled through-holes are sequentially plated with electroless copper, electrolytic copper, electroless nickel, and electroless gold.
J. A. Youngquist and R. M. Rowell, Proceedings 23rd Washington State University International Particle Board/Composite Materials Symposium, Pullman, WA, p. 141 (1989). [Pg.583]

E. Rofael and H.-A. May, Proceedings of the Seventeenth International Symposium on Particle Board Composite Materials, (T. M. Maloney, ed.) Washington State University, Pullman, Washington, pp. 283-295 (1983). [Pg.663]

Industrial fibers paper board, composites, textile fibers and bulk fibers. [Pg.401]

The production of moisture resistant particleboard by treatment with a maleic anhydride -glycerol mixture and using phenol formaldehyde as the matrix material has been investigated (Fujimoto etal., 1987). Boards prepared from modified wood showed considerable improvements in modulus of elasticity and internal bond strength when compared to control boards. Composites made from aspen fibres modified with SA, MA or acetic anhydride using phenol-formaldehyde (PF) or polypropylene as binder have also been studied (Clemons etal., 1992 Rowell etal., 1993b). The reaction of wood with MA was found to proceed at a slower rate than with SA. The volume increase due to modification... [Pg.81]

Decorative laminate is defined in ISO 472 but in common usage has come to mean sheet materials consisting of decorative surface papers impregnated with melamine resin and consolidated under heat and pressure with plies of core paper permeated with phenolic resin. In a wider sense the term can be applied to many associated products—including laminates in solid colour laminates with facings such as metal foils, textiles, or wood veneers polyester laminates direct faced boards and composite boards comprising thin laminates bonded to substrates of various kinds. [Pg.113]

When describing in more detail the characteristics and methods of manufacture of laminated sheet materials of different types it is helpful to use the classifications below, each of which is covered by a British Standard High-pressure laminates Decorative continuous laminates Direct-faced boards Composite boards. [Pg.114]

New, fill clay board, composition board and Star board. [Pg.218]

C. M. Daily, J. L. Johnson and D. R. Dalton, On the Measurements of Board Composition Poor Consistency and a Serious Mismatch of Theory and Operationalization, Decision Sciences, 30(1), 83-106 (1999). [Pg.482]

Soundwall boards composition (w/w) Ultimate load (P) (lb) Ultimate wind pressure (Ib/fF)... [Pg.283]

Mold is a type of fungus that can weaken building materials including composite deck boards, make composites discolored or cover them with black, green, red, and other colored spots that can be very difficult to remove, and can make people sick with allergies, asthma, or respiratory problems, particularly in those who are already poor in health and/or have a pulmonary condition. Mold is one of the champions of survival on the Earth. Mold spores exist in astronomical numbers virtually everywhere around us. Air currents carry spores on decks, as well as onto all other surfaces. [Pg.413]

Discrete batch, also called intermittent, refers to a facility in which processes are organized into separate work centers and products are moved in lots through a sequence of work centers in which each work center is set up for a specific set of operations on that product and the setup and sequence is specific to a product family. This describes a facility that can make a large but relatively fixed set of products but only a few types of product at one time, so the same product is made at intervals. This also describes a facility in which the technology is common— the set of processes and the ordering is relatively fixed, but the details of the process in each work center may vary considerably from product to product in the mix. Examples include semiconductors and circuit boards, composite parts, firearms, and machined metal parts made in quemtity. [Pg.330]

Siloxane-modified PAI resin compositions have been developed for the production of interlaminar adhesive films for wiring boards. The composition strongly adheres to the PI base layer and copper foil. ... [Pg.464]

CARB - CaMfomia Air Resources Board, Composite Wood Products Public Workshop, 20 June, 2006. [Pg.198]

A combination of a polymer layer with a board is used to package liquids such as milk, where the plastic layer provides the barrier to contain the milk within the package and the board the basic strength. Where it is necessary to store the beverage for long periods, such as fruit juices, additional barrier properties are required to prevent permeation of oxygen into the food product. To achieve this additional protection, an aluminum layer is incorporated within a plastic/board composite. [Pg.1592]

Borysiak S et al (2005) Method of preparation of board composites. Poland Patent No 190,405 George J, Sreekala MS, Thomas S (2001) A review on interface modification and characterization of natural fiber reinforced plastic ctnnposites. Polym Eng Sci 41 1471 Bledzki AK, Reihmane S, Gassan J (1998) Thermoplastics reinforced with wood fillers a literature review. Polym Plast Technol Eng 37 451-468... [Pg.289]

Table 4.5 PHRR values for fabric/board composites tested to FAR 25.853 Part IV Appendix F and cone calorimetry ... Table 4.5 PHRR values for fabric/board composites tested to FAR 25.853 Part IV Appendix F and cone calorimetry ...

See other pages where Board, boards composite is mentioned: [Pg.387]    [Pg.602]    [Pg.88]    [Pg.595]    [Pg.68]    [Pg.203]    [Pg.309]    [Pg.220]    [Pg.175]    [Pg.102]    [Pg.103]    [Pg.412]    [Pg.266]    [Pg.266]    [Pg.266]    [Pg.266]    [Pg.266]    [Pg.266]    [Pg.332]    [Pg.121]    [Pg.940]    [Pg.58]    [Pg.457]    [Pg.29]    [Pg.940]   
See also in sourсe #XX -- [ Pg.113 , Pg.114 , Pg.128 , Pg.129 , Pg.130 , Pg.133 , Pg.134 ]




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Fading of Composite Deck Boards Versus Their Crumbling Due to Oxidation

Fire Performance of Composite Decks and Deck Boards

Flexural Modulus of Composite Deck Boards

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Mathematical Model with Actual Conventional and Modified Composite Boards

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Wood composite boards, isocyanate

Wood composition board

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