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Bisphenol chemical structure

Figure 20.1 Chemical structure of bisphenol A based polycarbonate... Figure 20.1 Chemical structure of bisphenol A based polycarbonate...
Figure 20.6 Chemical structures of alternative condensation reactants with bisphenol A ... Figure 20.6 Chemical structures of alternative condensation reactants with bisphenol A ...
Fig. 10 Chemical structure of phthalate esters and bisphenol A. DMP dimethyl phthalate DEP diethyl phthalate DBP di-n-butyl phthalate DOP dioctyl phthalate DEHP diethyl-hexyl phthalate BBP butylbenzyl phthalate... Fig. 10 Chemical structure of phthalate esters and bisphenol A. DMP dimethyl phthalate DEP diethyl phthalate DBP di-n-butyl phthalate DOP dioctyl phthalate DEHP diethyl-hexyl phthalate BBP butylbenzyl phthalate...
Bisphenols is a broad term that includes many chemicals with the common chemical structure of two phenolic rings joined together by a bridging carbon. Bisphenol A is a monomer widely used in the manufacture of epoxy and phenolic resins, polycarbonates, polyacrylates and corrosion-resistant unsaturated polyester-styrene resins. It can be found in a diverse range of products, including the interior coatings of food cans and filters, water containers, dental composites and sealants. [4]. BPA and BP-5 were selected for testing by the whole... [Pg.933]

Figure 14.4 Chemical structures of two common epoxy chain extenders for PET (a) a diepoxide, e.g. Shell Epon 828, based on bisphenol A diglycidyl ether (b) a tetraepoxide, e.g. Ciba MY721, based on tetraglycidyl diaminodiphenyl methane (TGDDM)... Figure 14.4 Chemical structures of two common epoxy chain extenders for PET (a) a diepoxide, e.g. Shell Epon 828, based on bisphenol A diglycidyl ether (b) a tetraepoxide, e.g. Ciba MY721, based on tetraglycidyl diaminodiphenyl methane (TGDDM)...
The nucleophilic polycondensation has the advantage that the chemical structure and thus the properties of the poly(ether sulfone)s can be varied in a relatively simple way through the selection of the bisphenol components. [Pg.309]

A new family of bis(dienes), the bis(vinylbenzyl) ethers, has been synthesized and was used to modify bismaleimide (82). The chemical structure of divinylben-zyl-bisphenol A is provided in Fig. 27. [Pg.194]

The purpose of this paper is to investigate the mechanical properties (plastic deformation, micromechanisms of deformation, fracture) of several amorphous polymers considered in [1], i.e. poly(methyl methacrylate) and its maleimide and glutarimide copolymers, bisphenol A polycarbonate, aryl-aliphatic copolyamides. Then to analyse, in each polymer series, the effect of chemical structure on mechanical properties and, finally, to relate the latter to the motions involved in the secondary transitions identified in [ 1] (in most cases, the p transition). [Pg.219]

Bisphenol A polycarbonate (BPA-PC), whose the chemical structure is shown in Fig. 66a, has very interesting fracture properties, exhibiting quite a high toughness for a pure amorphous polymer. At a very low temperature (- 100 °C at 1 Hz) it presents a secondary fi transition, shown in Fig. 67, which has been analysed in detail in [1] (Sect. 5). [Pg.296]

In order to investigate the effect of a methyl substitution of the phenyl hydrogen in ortho position to the carbonate group, tetramethyl bisphenol A polycarbonate (TMBPA-PC), whose the chemical structure is shown in Fig. 66b, has also been considered. In the case of TMBPA-PC, the secondary fi transition happens at 50 °C, at 1 Hz (Fig. 67), in such a way that it allows one to examine the consequences of such a large shift of the fi transition on the mechanical properties. [Pg.296]

FIGURE 2.7 Chemical structure of bisphenol F resin (4,4 isomer). [Pg.33]

Fig. 8.5 Chemical structures of EDCs (a) bisphenol-A (b) triclosan (c) nonylphenol (d) 17b-estradiol (e) genistein (f) b-sitosterol... Fig. 8.5 Chemical structures of EDCs (a) bisphenol-A (b) triclosan (c) nonylphenol (d) 17b-estradiol (e) genistein (f) b-sitosterol...
This formulation is laid down by electrophoresis over the material to be coated, acting as the cathode, and finally heat cured. The process requires molecules with chemical structure suitably designed for different applications, and the chemistry of Mannich bases may represent a convenient tool for preparing variously substituted derivatives. In fact, as depicted in Fig. 187, the reactive functions leading to the final crosslinked material may be bound to several different positions of the oligomeric epoxy resin. The Mannich derivatives of bisphenol A (572)2 " - > -2 and nonylphenol (573)202.2a i.2()6 con-... [Pg.125]

The epoxy resin most frequently used is the oligomer of the diglycidyl ether of bisphenol-A (DGEBA) whose chemical structure is shown below [1-3]. [Pg.142]

A polymer having the bisphenol-A backbone structure is called a phenoxy resin. Its chemical structure is as follows ... [Pg.147]

Monomers. The CE monomers, 4,4 -dicyanato-l,l-diphenylethane (DPEDC) and dicyanate of bisphenol A (DCBA), were provided by Ciba-Geigy (Louisville, KY) in reference Arocy L10 and Arocy BIO, and were used as received. Liquid DPEDC contains 2-3% impurities (trimer, monophenol-monocyanate, and ortho-para-substituted isomers). DCBA is a high-purity (>99.5%) crystalline powder (melting temperature 79 °C). The chemical structures of these monomers are shown in Chart I. [Pg.187]

This study demonstrated that the final destination of the added core-shell rubber particles, in PC, PA, or both, in the PC-PA binary blend can be controlled by properly selecting the chemical structure of the shell in the core-shell rubber. The unreactive MBS rubber tends to reside in the PC phase and near the vicinity of the PC-PA interface. The reactive MBS-MA rubber can have a chemical reaction with PA end groups and can therefore be retained within the PA phase. High-molecular-weight bisphenol A epoxy resin has proved to be an efficient compatibilizer for PC-PA blends. Rubber-toughening of the PC-PA blend in which PC is the matrix is much more effective than with blends in which PA is the matrix. [Pg.294]

Bisphenol A type epoxy resin (Epikote 828 Shell) cured with modified amine (Epomate B002 Shell) was used as the matrix of the dismantlable adhesive (re-sin/matrix=2 1 w/w). Fig. 34.3 shows their chemical structures. The bulk adhesive was cured at room temperature for 24 h before the experiments. Cured bulk resin mixed with the microcapsules was used for the specimens to measure the volume change. [Pg.558]

This full IPN combines the network of an NLO active epoxy-based polymer and the network of an NLO active phenoxy-silicon polymer. l The epoxy-based NLO network is prepared from the epoxy prepolymer (BPAZO) based on the diglycidyl ether of bisphenol A and 4-(4 -nitrophenylazo)aniline functionalized with crosslinkable acryloyl groups. The second NLO network of a phenoxy-silicon polymer is based on an alkoxysilane dye (ASD) of (3-glycidoxypropyl)trimethoxysilane and 4(4 -nitrophenylazo)aniline, and the multifunctional phenoxyl molecule 1,1,1- tris(4-hydroxyphenyl)ethane (THPE).22 Figure 4 shows the chemical structures of BPAZO, ASD, and THPE. Each network can be formed... [Pg.232]

Chart 2.6 Chemical structure of bisphenol A polycarbonate, poly(oxycarbonyloxy-l, 4-pheny-lene-isopropylidene-l,4-phenylene). [Pg.68]


See other pages where Bisphenol chemical structure is mentioned: [Pg.150]    [Pg.44]    [Pg.317]    [Pg.318]    [Pg.318]    [Pg.916]    [Pg.105]    [Pg.136]    [Pg.87]    [Pg.3]    [Pg.477]    [Pg.497]    [Pg.40]    [Pg.223]    [Pg.705]    [Pg.166]    [Pg.222]    [Pg.557]    [Pg.2720]    [Pg.14]    [Pg.134]    [Pg.2697]    [Pg.213]    [Pg.14]    [Pg.183]    [Pg.70]    [Pg.193]    [Pg.167]   
See also in sourсe #XX -- [ Pg.217 ]

See also in sourсe #XX -- [ Pg.217 ]




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Bisphenol

Bisphenols

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