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At- resistance

Problems have also been observed at resist coat due to substrate nonwetting or oleophobicity. This problem is independent of the more commonly occurring pattern lifting (see Fig. 3 for examples of missing or displaced images) adhesion failure problem, which is observed after resist exposure and development. We will also focus on work addressing these latter two specific problem areas in this paper. [Pg.442]

Resist materials are usually polymeric in nature and are spun from organic solvents of moderate to low volatility. As such, these bi- or tricomponent liquid spinning systems also usually possess low surface tension and will wet most solid surfaces involved in the technology discussed above, except those with a very low energy and/or contaminated surfaces. This type of substrate presents a problem at resist coat due to nonwetting [2, 9]. In cases where it is observed, the lithographic process cannot be completed without further substrate surface process modification. Needless to say, added process steps are economically unattractive, but sometimes required. [Pg.444]

Substrate nonwetting at resist coat has been observed most frequently with reworked and mistakenly overpromoted wafers. It occurs after repeated treatments, when the wrong liquid silane treatment has been applied, or when vapor times exceed the optimum time for that respective substrate. It can also occur in selected circuit pattern areas and not for the whole layer. Nonwetting is also... [Pg.447]

Recently approved antimicrobial agents such as quinupristin-daflbpristin and linezohd have been targeted at resistant gram-positive bacteria. Numerous other drugs currently in development also have enhanced activity against these bacteria. [Pg.1917]

Ue now consider the main technical factors underlying attempts at resistance management resistance mechanisms, cross tolerance/resistance, and resistance monitoring. [Pg.122]

For film AT resistance one can equate the rate of heat removal through the film with the rate of heat generated or absorbed by the reaction within the porous support. Thus for the general heterogeneous catalytic... [Pg.277]

Mortars and concretes made with high alumina cement are resistant against sulphate attack and also are better at resisting CO2 from ordinary drinking or mineral water. In comparison, the resistance against alkalis is lower than that of Portland cements. [Pg.70]

Since these neurotoxins target channels with similar shapes, the neurotoxins themselves look similar. Animals like amphibians defend themselves from predators with tetrodotoxin, a small molecule that blocks predator s sodium channels, leaving them with quite a bad taste in their mouths. Then the snakes that eat amphibians remolded their sodium channels so the tetrodotoxin can t fit snugly. Six species of snakes at three places around the world all reshaped their sodium channels in the exact same way, making them worse at moving sodium but better at resisting the toxin (they sacrificed sodium channel efficiency so they could eat toxic amphibians). The shape that resists the channel-blocking toxin is as predictable as the shape that channels the sodium. [Pg.229]

Sediment or debris can cause underdeposit corrosion or turbulence that can damage or remove the protective film, particularly on the less resistant copper-based alloys. Effective screening or filtering can limit this problem. Copper alloys are, in general, better at resisting the attachment of organisms than stainless steels or nickel alloys. [Pg.293]

Likewise, Fig. 8.7c shows statistically significant increases in the yield stress with the addition of nanotubes to PP. Furthermore, the increase to a maximum value followed by a decrease is also observed. However, the maximum occurs at a higher concentration range of about 0.5-1 wt% MWNTs. Additionally, the increase is not as significant and pronounced as in the case of the toughness and modulus, indicating that the nanotubes are not as effective at resisting plastic deformation. [Pg.248]


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See also in sourсe #XX -- [ Pg.6 , Pg.97 , Pg.99 , Pg.104 ]




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