Thermal resistance Management

The thermal conduction in composite-to-Cu-clad-Mo joints is important for thermal management applications. For 1-D steady-state heat conduction, the joined materials form a series thermal circuit with an effective thermal resistance, Rcfr - S(Ax,/IC,), where Axi and K, are the thickness and... 

Mineral-Filled Composites. Epoxy mineral-filled composites are widely used to manufacture laboratory equipment such as lab bench tops, sinks, hoods, and other laboratory accessories. The excellent chemical and thermal resistance properties of epoxy thermosets make them ideal choices for this application. Typically, liquid epoxy resins of bisphenol A are cured with anhydrides such as phthaUc anhydride, which provide good exotherm management and excellent thermal performance. The systems are highly filled with fillers such as silica or sand (up to 70 wt%). Multifunctional epoxy novolacs can be added when higher chemical and thermal performance is needed. 

The synthesis of AIN described by Janes et al. (2003) may be mentioned as an example. The applications of this compound, mainly as a management material for silicon-based electronics, have been summarized together with its relevant properties (low coefficient of thermal expansion, close to that of Si, high thermal conductivity, high resistivity and low dielectric constant). Different preparation methods, often involving complex instruments, have been mentioned ion beam evaporation,... 

Another amorphous phase of carbonitride, C N phase with sp bonding, was shown to be a stable phase which exhibits high electrical resistivity and thermal conductivity similar to that of diamond-like films. The diamond-like properties and non-diamond-like bonding make C N an attractive candidate for applications such as thermal management in high-performance microelectronics. 

At the chip level, thermal management solutions need high performance heat spreaders to minimize thermal contact resistance ... 

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