Adhesives density

Concurrent bombardment during film growth affects film properties such as the film—substrate adhesion, density, surface area, porosity, surface coverage, residual film stress, index of refraction, and electrical resistivity. In reactive ion plating, the use of concurrent bombardment allows the deposition of stoichiometric, high density films of compounds such as TiN, ZrN, and Zr02 at low substrate temperatures. 

Although the primary purpose of this chapter is to discuss mechanical testing and strength of adhesive joints, the reader should be aware that ASTM covers a wide variety of tests to measure other properties. ASTM, for example, includes standard tests to measure the viscosity of uncured adhesives, density of liquid adhesive components, nonvolatile content of adhesives, filler content, extent of water absorption, stress cracking of plastics by liquid adhesives, odor, heat stability of hot-melt adhesives, ash content, and similar properties or features of adhesives. 

The manufacture of MDF, with a few exceptions, dupHcates the manufacture methods for dry-process hardboard, described at length hereia. One exception to it is that most MDF is made ia the medium-density range, 640—800 kg/m although small amounts are made at lower or higher densities. Second, the vast majority of MDF is made with UF resia adhesives with resia requhemeats ia the 7—11% range, and wax is usually added at the 0.50—0.75% level. A small amount of exterior-grade MDF is made with isocyanate resia. 

This type of adhesive is generally useful in the temperature range where the material is either leathery or mbbery, ie, between the glass-transition temperature and the melt temperature. Hot-melt adhesives are based on thermoplastic polymers that may be compounded or uncompounded ethylene—vinyl acetate copolymers, paraffin waxes, polypropylene, phenoxy resins, styrene—butadiene copolymers, ethylene—ethyl acrylate copolymers, and low, and low density polypropylene are used in the compounded state polyesters, polyamides, and polyurethanes are used in the mosdy uncompounded state. 

Dispersion at temperatures of 90—110°C is a common final step io European mills processiog wax-coated old cormgated containers. Dispersion temperatures less than 90°C are reported to reduce wax particle size to improve pulp drainage properties on paper machines while improving paper strength (45). Dispersion has been used to reduce hot-melt adhesive, plastic coating, and asphalt particle size. These low density particles can then be removed from the pulp by flotation (46). 

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