Adhesive adh

McGuiggan PM, Chiche A, EiUiben JJ, Phelan FR, Fasolka MJ, Yarusso DJ (2006) High-throughput peel measurement of a pressure-sensitive adhesive. Adhes Mag 13 32-39... [Pg.104]

Fowkes, F.M. (1987) Role of acid-base interfacial bonding in adhesion. /. Adhes. Sci. Technol, 1, 7-27. [Pg.45]

Steele, P.H. R.E. Kreibich P.J. Steynberg R.W. Hemingway. Finger jointing green southern yellow pine with a soy-based adhesives. Adhes. Age 1998, 41, 49-56. [Pg.616]

For comparison with FM 300K, specimens of the following five adhesives were tested 3M 3559 made by 3M Co. and four adhesives Adh 14, Adh 96, Adh 98, and Adh II-3H made by Martin Marietta. FM 300K was intended for possible application in highway bridges the others were intended for use on military bridges. For more information on the properties of the latter... [Pg.38]

Hermansen RD, Tunick SA. Formulating custom-tailored thermal transfer adhesives. Adhes Age. Oct. 1989. [Pg.73]

Pizzi A 1977 Hot-setting tannin-urea-formaldehyde exterior wood adhesives. Adhes Age 20(12) 27-29... [Pg.1024]

Dillard, D.A. and Yu, J.-H., Revisiting bimaterial curvature measurements for CTE of adhesives. Adhes. Meas. Films Coatings, 2, 329-340 (2001). [Pg.44]

Kanehira, M. et al. (2006) Relationship between degree of polymerization and enamel bonding strength with selfetching adhesives. / Adhes. Dent, 8 (4), 211-216. [Pg.169]

Lyons D, ChristeU LA (1997) Waterborne polychloroprene adhesives. Adhes Sealants Ind 4 46-50... [Pg.1346]

Ratna D, Banthia A (2000) Epoxidized soybean oil toughened epoxy adhesive. J Adhes Sci Tech 14 15 Sauer H, Spiekermann S et al (2004) Acalerated curing with microwaves and nanoferrites. Adhesion. Adhes Sealants 2003/2004 48-50... [Pg.1526]

Sprenger S, Eger C et al (2004) Nano-modified ambient temperature curing epoxy adhesives. Adhesion. Adhes Sealants 2003/2004 20-23 Umemura K, Inoue A et al (2003) Development of new natural polymer-based wood adhesives I dry bond strength and water resistance of konjac glucomannan, chitosan, and their composites. JWood Sci 49 221... [Pg.1526]

Dake K. The right light for epoxies. Test methods and optimum cure conditions for epoxy adhesives,. Adhes Age. 2002 45(12) 12—14. [Pg.241]

Dorbmann A. UV-curable hot-melt pressure sensitive adhesives. Adhes Technol. 2000 17 (2) 14-16. [Pg.242]

Wegman RE, Ross MC, Gamis EA, Slota SA. A new technique for assessing durability of structural adhesives. Adhes Age 1978 21(7) 38—41. [Pg.337]

Pandiri, S.M. The behavior of silver flakes in conductive epoxy adhesives. Adhes. Age, 1987 31-35. Gunther, B. Schafer, H. Porous metal powders for conductive adhesives. Proceedings of the 2nd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Stockholm, Sweden, June 1996 55-59. [Pg.766]

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