Adhesion of deposits

The selection of a particular deposition process depends on the material to be deposited and its availabiUty rate of deposition limitations imposed by the substrate, eg, maximum deposition temperature adhesion of deposit to substrate throwing power apparatus required cost and ecological considerations. Criteria for CVD, electro deposition, and thermal spraying are given in Table 2 (13). 

D.M. Mattox, Interface formation and the adhesion of deposited thin films, SC Monogr. R-65 852, Sandia Corp., 1965. 

In electrochemical pickling the objective is to remove rust and other oxides and sometimes to produce a uniform etch to produce adhesion of deposits. The surface is made anoidc in an acid medium, e.g. H2SO4 or FeCla. 

Note S—Heater tubes must not be reused. Tests indicate that magnesium migrates to the heater tube surface under norma] test conditions. Surface magnesium may reduce adhesion of deposits to reused heater tube. 

Of practical interest are detailed studies to influence the magnetooptical properties of RE-TM materials by the substrate material and the substrate adhesion of RE-TM layers by the selected deposition technique (226). Accordingly, measurements have been performed on glass, BPA-polycarbonate, and poly(ethylene terephthalate) (as a flexible substrate). 

Catalysis. Ion implantation and sputtering in general are useful methods for preparing catalysts on metal and insulator substrates. This has been demonstrated for reactions at gas—soHd and Hquid—soHd interfaces. Ion implantation should be considered in cases where good adhesion of the active metal to the substrate is needed or production of novel materials with catalytic properties different from either the substrate or the pure active metal is wanted (129—131). Ion beam mixing of deposited films also promises interesting prospects for the preparation of catalysts (132). 

In the suspension methods, agglomerate formation occurs by hardening of feed droplets into soHd particles, by layering of soHds deposited from the feed onto existing nuclei, and by adhesion of small particles into aggregates as binding soHds from the dispersed feed are deposited. The product size achievable in these methods is usually limited to ca 5 mm and is often much smaller (see Drying). 

Bouncing may be regarded as a defect in the particle-deposition process. However, particles that have been deposited in filters may subsequently be blown off and reentrained into the air stream (Corn, Adhesion of Particles, in Davies, Aerosol Science, Academic, New York, 1966 and Davies, op. cit.). 

Other topics recently studied by XPS include the effects of thermal treatment on the morphology and adhesion of the interface between Au and the polymer trimethylcy-clohexane-polycarbonate [2.72] the composition of the surfaces and interfaces of plasma-modified Cu-PTFE and Au-PTFE, and the surface structure and the improvement of adhesion [2.73] the influence of excimer laser irradiation of the polymer on the adhesion of metallic overlayers [2.74] and the behavior of the Co-rich binder phase of WC-Co hard metal and diamond deposition on it [2.75]. 

Another exception to the rule of contaminated surfaces involves very small particles, generally referred to as nanoclusters. These are generally formed and the adhesion of the.se particles to substrates studied in situ, under ultrahigh vacuum conditions. Owing to the vacuum and the short existence of these particles prior to deposition, it is possible for chemistry to occur. 

Adhesion of copper films to PMDA/ODA polyimide was determined by peel tests conducted on samples that were prepared by vapor-depositing a thin layer of copper onto the polyimide and then building the thickness of the metal layer to about 18 p,m by electrodeposition of copper. Results of the adhesion measurements correlated well with substrate pretreatment. When the substrate... 

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