Waferboard manufacture, conditions

Recent work has concentrated on the use of ALCELL lignin as a substitute for phenol-formaldehyde resins in wood adhesives, particularly wafer-board. Some of the results obtained when a PF resin (Bakelite 9111) was replaced with different levels of hardwood ALCELL lignin in waferboard manufacture will be briefly discussed below. Table III shows the conditions used for waferboard manufacture. 

Isocyanates. The influence of various manufacturing parameters on the properties (IB, MOE, MOR, boiled MOR) of waferboard bonded by polymeric isocyanates was examined. The amount of adhesive used was 1.5-2.25%, the press time was 1-3 min, the temperature was 177-204 °C, and the density of the boards was 0.679 g/cm. The experiments indicated that under the conditions used the National Bureau of Standards (NBS) 2-B-2 standards can be achieved (J93). 

Particleboard and other products made with isocyanates emit only little formaldehyde (IJ, but these adhesives are expensive and require expensive manufacturing procedures. In contrast, phenolic soft wood plywood is a well established product that is predominantly used for exter i or appIi cat i ons. It conta i ns forma Idehyde i n chemically strongly bonded form and also emits little formaldehyde, as shown in a later chapter in this book. In fact, under almost all common use conditions this type of board contributes not much more formaldehyde than is already present in ambient air in many urban areas. The same is true for waferboard, which has recently become popular for replacing plywood. Likewise, phenolic particleboard emits little forma Idehyde, unIess the phenoIi c res in is bIended w i th UFR. Normally, the products with highest potential for formaldehyde emission are those bonded with UFR. During the past year, approximately 300,000 metric tons of UFR have been used for panel manufacturing in the U.S. 

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