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Wafer guide

The carrier mainly comprises Carrier head-1 (2), Carrier head-2 (3), Wafer guide (4), as well as Gimbal (5), and is held as well as rotated by Shaft (6). [Pg.424]

Fig. 5. Hydrogen depth profile of a deuterated polystyrene PS(D) film deposited on a protonated polystyrene PS(H) film on top of a silicon wafer as obtained by l5N-nuclear reaction analysis ( 5N-NRA). The small hydrogen peak at the surface is due to contamination (probably water) of the surface. The sharp interface between PS(D) and PS(H) is smeared by the experimental resolution (approx. 10 nm at a depth of 80 nm) [57], The solid line is a guide for the eye... Fig. 5. Hydrogen depth profile of a deuterated polystyrene PS(D) film deposited on a protonated polystyrene PS(H) film on top of a silicon wafer as obtained by l5N-nuclear reaction analysis ( 5N-NRA). The small hydrogen peak at the surface is due to contamination (probably water) of the surface. The sharp interface between PS(D) and PS(H) is smeared by the experimental resolution (approx. 10 nm at a depth of 80 nm) [57], The solid line is a guide for the eye...
Fig. 6. Hydrogen depth profile of a thin film of poly(p-methylstyrene)(H)/ PS(D) diblock copolymer, PMS(H)-b-PS(D), on a silicon wafer as obtained by the l5N-NRA technique [57]. The sample has been annealed for 1 h at 140 °C. PMS(H) is largely enriched at the surface. The solid line is a guide to the eye... Fig. 6. Hydrogen depth profile of a thin film of poly(p-methylstyrene)(H)/ PS(D) diblock copolymer, PMS(H)-b-PS(D), on a silicon wafer as obtained by the l5N-NRA technique [57]. The sample has been annealed for 1 h at 140 °C. PMS(H) is largely enriched at the surface. The solid line is a guide to the eye...
Heat transfer was accomplished by guiding flows through different wafer levels, some acting as energy source, others as heat sink. For cooling, circulating liquids were applied. [Pg.281]

Figure 11.5. Langmuir-Blodgett (LB) technique-assisted NW assembly (a) Schematic of LB-guided assembly. NWs are floated on a water surface and compressed through computer guided pressure, (b) SEM image of silver NWs deposited on Si wafer. Reprinted with permission from Ref. 54. Copyright 2003 American Chemical Society. Figure 11.5. Langmuir-Blodgett (LB) technique-assisted NW assembly (a) Schematic of LB-guided assembly. NWs are floated on a water surface and compressed through computer guided pressure, (b) SEM image of silver NWs deposited on Si wafer. Reprinted with permission from Ref. 54. Copyright 2003 American Chemical Society.
A piezoelectric pump is constructed with two glass plates and a silicon wafer [22]. A pressure chamber and a raised flat surface suspended with a thin diaphragm are formed on the upper glass plate (Fig. 3). The piezoelectric actuator is placed on the raised flat surface. In order to guide the flow of the pumped liquid, two check valves made of poly-silicon are fabricated on the silicon wafer... [Pg.222]

Hardin, Winn. Vision Systems Guide Wafers Through Manufacturing Process. VerticalNet Pubhcations. (March 1,2000). [Pg.187]

Recently, Tu and Zemel constructed a fiber-optic-based pressure sensor that employed an etched channel for guiding a single-mode optical fiber to a thin membrane perpendicular to the wafer surface [61]. This is depicted in figure... [Pg.332]

SEMI Document M43 Guide for Reporting Wafer Nanotopography, 2001. [Pg.174]

SEMI Draft Document 3089 A Guide for Reporting Wafer Nanotopography, 1999. Semiconductor Industry Association. Front end processes in international technology roadmap for semiconductor, p. 4. [Pg.174]

Figure 16.7 Use of piezoelectric wafer active sensors (PWAS) for damage detection with ]MDpagating and standing guided waves in thin-waU structures, (a) pitch-catch (b) pulse-echo (c) thickness mode (d) impact and acoustic emission (AE) detection (e) electromechanical (E/M) impedance (f) PWAS phased array. Figure 16.7 Use of piezoelectric wafer active sensors (PWAS) for damage detection with ]MDpagating and standing guided waves in thin-waU structures, (a) pitch-catch (b) pulse-echo (c) thickness mode (d) impact and acoustic emission (AE) detection (e) electromechanical (E/M) impedance (f) PWAS phased array.
Yu L, Giurgiutiu V. In situ 2-D piezoelectric wafer active sensors arrays for guided wave damage detection. Ultrasonics 2008 48(2) 117—34. http //dx.doi.0rg/lO.lOl6/ j.ultras.2007.10.008. [Pg.504]

In MEMS-based optical biosensor systems, similar configurations are used. Light propagates in free space or is guided by optical fibers or planar optical waveguides. In one setup, only the mechanical stmeture (mirror, cantilever, or reaction chamber) is fabricated on wafers. After... [Pg.1750]


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