Verification Liquidation and Evaporation

The BOLS premise indicates that the overheating of In/Al (T mjn/T m.Ai = 530/ 932), Pb/Al (600/932), Pb/Zn (600/692), and Ag/Ni (1235/1726) [71] results from the interfacial bond strengthening. An atom performs differently at a free surface from this atom at the interface. Although the coordination ratio at the interfaces suffers little change (zjb 1), formation of the interfacial compound or alloy alters the nature of the interatomic bond that should be different in strength. In this case, one may replace the ZibCf with a parameter a to describe the interfacial bond enhancement, as indicated in panel (g). 

Numerical fitting turns out the a value of 1.8, which indicates that an interfacial bond is 80 % stronger than the bond in the parent bulk. If one considers the bond contraction, 0.90 0.92 [72], as the As and Bi impurities in CdTe compound, the m value is around 5.5-7.0. The high m value indicates that bond nature indeed evolves from a compound with m around four to a value of more covalent nature. Therefore, the deformed and shortened interfacial bond is much stronger. This finding means that electrons at an interface are deeply entrapped and densified. Therefore, it is understandable that twins of nanograins [73] and the multilayered structures [74] are stronger and thermally more stable. 

It is anticipated therefore that a thin insulating layer could form in a heterojunction interface because of the interfacial bond nature alteration and the charge 

Tm is the intercept of least-root-mean-square linearization of the experimental data that calibrate the measurements. Atomic sizes are referred to Appendix A2 

For metals, m = 1. For embedded system, the ZibCT is replaced with a constant a that describes the bond strength enhancement due to the alloying at the interfaces 

---