Two-Component Adhesive Formulations

TABLE 12.2 General-Purpose Two-Component Epoxy Adhesive Cured with DEAPA1 [Pg.229]

Temperature-resistant two-part, elevated-temperature curing epoxy adhesives can be formulated with aromatic amines, such as metaphenylenediamine (MPDA), methylene dianiline (MDA), or a eutectic blend of the two. These adhesives will provide relatively high temperature strength, but they are generally brittle. When mixed with epoxy resin at concentrations of about 15 pph for MPDA and 26 pph for MDA, they provide complete cure in about 30 min at 175°C. The aromatic amines also provide a working life of several hours at room temperature. Starting formulations for aromatic amine cured epoxy adhesives are shown in Table 12.4. [Pg.230]

MDA cured epoxy adhesive will provide shear strength over 4 times that of DETA at temperatures of 100 to 150°C. Table 12.5 indicates the high-temperature performance that [Pg.230]

TABLE 12.3 Elevated-Temperature Curing Epoxy Adhesive Formulations [Pg.230]

TABLE 12.4 Starting Formulations for Epoxy Adhesives Cured with MPDA2 [Pg.231]

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