Tungsten temperature

Fig. 34. Sticking probability for nitrogen on the [320] plane of tungsten. Temperature is a parameter. (From Ref. )...

A derived experimental result consists in plots of s vs. 6 such as the two shown in Figure 15 for 300 and OOO K. At 300° K. the sticking probability is 0.55 and remains constant with the amount adsorbed until 3 — 1.0 between 6 = 1 and 6 = 2 it decreases rapidly and at 6 = 2.0 it is about 4 X 10 . Between 3 = 1.25 and 2.0, log. decreases linearly with 3. At higher tungsten temperatures, s is again constant with 3 but has a smaller value and begins to decrease at a smaller value of 3. We have obtained curves like these for a number of tungsten ribbons. They all have the same shapes and all vary with T in the same way however, the values of s differ from ribbon to ribbon, probably because of a difference in crystal size and differences in the types of crystal planes... 

Temperature. Temperature influences the rate of all reactions occurring during reduction, hence the dynamic humidity and partial pressure of the volatile [W02(OH)2] which forms during reduction and which is responsible for the chemical vapor transport (CVT) of tungsten. Temperature and tungsten particle size are directly proportional while temperature and time required for final reduction are inversely proportional. 

Fig. 4. The first reported flash filament desorption spectrum showing the a and jS phases of CO adsorbed on tungsten. (Temperature range 80-2200°K.) [Redrawn from Hick-mott and Ehrlich 19). Reproduced by permission of the American Institute of Physics.]...

It is alloyed with iron, nickel and other metals to make Alnico, an alloy of unusual magnetic strength with many important uses. Stellite alloys, containing cobalt, chromium, and tungsten, are used for high-speed, heavy-duty, high temperature cutting tools, and for dies. 

Tantalum is a gray, heavy, and very hard metal. When pure, it is ductile and can be drawn into fine wire, which is used as a filament for evaporating metals such as aluminum. Tantalum is almost completely immune to chemical attack at temperatures below ISOoC, and is attacked only by hydrofluoric acid, acidic solutions containing the fluoride ion, and free sulfur trioxide. Alkalis attack it only slowly. At high temperatures, tantalum becomes much more reactive. The element has a melting point exceeded only by tungsten and rhenium. Tantalum is used to make a variety... 

Thermal Conductivity Detector One of the earliest gas chromatography detectors, which is still widely used, is based on the mobile phase s thermal conductivity (Figure 12.21). As the mobile phase exits the column, it passes over a tungsten-rhenium wire filament. The filament s electrical resistance depends on its temperature, which, in turn, depends on the thermal conductivity of the mobile phase. Because of its high thermal conductivity, helium is the mobile phase of choice when using a thermal conductivity detector (TCD). 

The electron sources used in most sems are thermionic sources in which electrons are emitted from very hot filaments made of either tungsten (W) or lanthanum boride (LaB ). W sources are typically heated to ca 2500—3000 K in order to achieve an adequate electron brightness. LaB sources require lower temperatures to achieve the same brightness, although they need a better vacuum than W sources. Once created, these primary electrons are accelerated to some desired energy with an energy spread (which ultimately determines lateral resolution) on the order of ca 1.5 eV. 

Early catalysts for acrolein synthesis were based on cuprous oxide and other heavy metal oxides deposited on inert siHca or alumina supports (39). Later, catalysts more selective for the oxidation of propylene to acrolein and acrolein to acryHc acid were prepared from bismuth, cobalt, kon, nickel, tin salts, and molybdic, molybdic phosphoric, and molybdic siHcic acids. Preferred second-stage catalysts generally are complex oxides containing molybdenum and vanadium. Other components, such as tungsten, copper, tellurium, and arsenic oxides, have been incorporated to increase low temperature activity and productivity (39,45,46). 

There is often a wide range of crystalline soHd solubiUty between end-member compositions. Additionally the ferroelectric and antiferroelectric Curie temperatures and consequent properties appear to mutate continuously with fractional cation substitution. Thus the perovskite system has a variety of extremely usehil properties. Other oxygen octahedra stmcture ferroelectrics such as lithium niobate [12031 -63-9] LiNbO, lithium tantalate [12031 -66-2] LiTaO, the tungsten bron2e stmctures, bismuth oxide layer stmctures, pyrochlore stmctures, and order—disorder-type ferroelectrics are well discussed elsewhere (4,12,22,23). 

Molybdenum hexafluoride is used in the manufacture of thin films (qv) for large-scale integrated circuits (qv) commonly known as LSIC systems (3,4), in the manufacture of metallised ceramics (see MetaL-MATRIX COMPOSITES) (5), and chemical vapor deposition of molybdenum and molybdenum—tungsten alloys (see Molybdenumand molybdenum alloys) (6,7). The latter process involves the reduction of gaseous metal fluorides by hydrogen at elevated temperatures to produce metals or their alloys such as molybdenum—tungsten, molybdenum—tungsten—rhenium, or molybdenum—rhenium alloys. 

Rhenium hexafluoride is a cosdy (ca 3000/kg) material and is often used as a small percentage composite with tungsten or molybdenum. The addition of rhenium to tungsten metal improves the ductility and high temperature properties of metal films or parts (11). Tungsten—rhenium alloys produced by CVD processes exhibit higher superconducting transition temperatures than those alloys produced by arc-melt processes (12). 

Chrome—nickel alloy heating elements that commonly ate used in low temperature furnaces are not suitable above the very low end of the range. Elements commonly used as resistors are either silicon carbide, carbon, or high temperature metals, eg, molybdenum and tungsten. The latter impose stringent limitations on the atmosphere that must be maintained around the heating elements to prevent rapid element failure (3), or the furnace should be designed to allow easy, periodic replacement. 

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