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Thin-film multilayer processing yield

In all but the simplest electronic circuits, it is necessary to have a method for fabricating multilayer interconnection structures to enable all the necessary points to be connected. The thick film technology is limited to three layers for all practical purposes because of yield and planarity considerations, and thin-film multilayer circuits are quite expensive to fabricate. The copper technologies can produce only a single layer because of processing limitations. [Pg.281]


See other pages where Thin-film multilayer processing yield is mentioned: [Pg.480]    [Pg.708]    [Pg.258]    [Pg.555]    [Pg.31]    [Pg.671]    [Pg.358]    [Pg.1192]    [Pg.358]    [Pg.21]    [Pg.164]    [Pg.181]    [Pg.546]    [Pg.22]    [Pg.2112]    [Pg.28]    [Pg.3575]    [Pg.23]    [Pg.32]    [Pg.1265]    [Pg.301]    [Pg.355]    [Pg.307]    [Pg.123]    [Pg.842]    [Pg.140]    [Pg.140]   
See also in sourсe #XX -- [ Pg.481 ]




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