Thermal expansion table

Glass-fibre-filled polysulphones are also available. These show significantly increased creep resistance and lower coefficients of thermal expansion (Table 21.4). 

Liquids can also exert pressure due to thermal expansion. Table 4.15 provides an indication of pressure increases due to temperature increases for selected common liquids in full containers or pipes. Serious accidents can arise unless the design of rigid plant items such as pipework takes into account the changes in volume of liquids with temperature fluctuation by the following or combinations thereof ... 

Zirconia (Zr02) has the stiffness of steel, a density which is only 50% higher than that of alumina, a relatively high coefficient of thermal expansion (Table I) and excellent chemical... 

Pu is a typically silver-white appearing metal which has a number of peculiar physical properties. The metal undergoes a total of five allotrppic modifications below the melting point, two of which have negative coefficients of thermal expansion. Table IV-1 summarizes the more important physical properties. 

Linear Thermal Expansivity. Values of the linear thermal expansivity (Tables 4 and 6) tend to be high, especially in comparison with ceramics and most metals. Hence this property, apart from its inherent scientific interest, has considerable practical importance, especially in polymer processing and in composite structures where metallic or ceramic phases are present. 

There is little to be gained by using relatively large, two-terminal devices on thermoplastic materials. Two-terminal devices such as chip resistors are based on ceramic bodies, and consequently they have extremely low coefficients of thermal expansion (Table 5.1). The difference in CTE vis- -vis the thermoplastic substrate material is highest for this type of component. Given the absence of conditionally elastic connector legs, this type of device is extremely stiff and consequently unable to prevent deformation at the point of connection. 

The polymer matrix used in this study is that of a family of Polyethablockamides known by the trade name Pebax. The grade used was that of Pebax 7033. The data required for the analysis include the yield stress, yield strain, initial modulus, secondary modulus, ultimate stress and ultimate strain. Other data needed is the Poisson s ratio and linear coefficient of thermal expansion. Table 1 lists the relevant properties. 

The electronic configuration for an element s ground state (Table 4.1) is a shorthand representation giving the number of electrons (superscript) found in each of the allowed sublevels (s, p, d, f) above a noble gas core (indicated by brackets). In addition, values for the thermal conductivity, the electrical resistance, and the coefficient of linear thermal expansion are included. 

This table lists values of /3, the cubical coefficient of thermal expansion, taken from Essentials of Quantitative Analysis, by Benedetti-Pichler, and from various other sources. The value of /3 represents the relative increases in volume for a change in temperature of 1°C at temperatures in the vicinity of 25°C, and is equal to 3 a, where a is the linear coefficient of thermal expansion. Data are given for the types of glass from which volumetic apparatus is most commonly made, and also for some other materials which have been or may be used in the fabrication of apparatus employed in analytical work. 

The typical mechanical properties that qualify PCTFE as a unique engineering thermoplastic are provided ia Table 1 the cryogenic mechanical properties are recorded ia Table 2. Other unique aspects of PCTFE are resistance to cold flow due to high compressive strength, and low coefficient of thermal expansion over a wide temperature range. 

With disk diameters above 5.25 in., all parameters, eg, water absorption and thermal expansion, become more critical which aggravates the expansion or warp of disks. If in the future disk rotation speeds have to be increased significantly to boost data transfer rates, higher demands will be placed on warp (tilt angle) and modulus to avoid creeping (ie, irreversible elongation in radial direction). A survey of the requirement profile for the substrate material of optical disks is given in Table 5 (182,186,187,189). 

Other properties, eg, strength, resistivity, heat capacity, and thermal expansion, are given in the reference (2,4) from which this table is compiled. 

Thermal Expansion. Coefficients of linear thermal expansion and linear expansion during transformation are listed in Table 7. The expansion coefficient of a-plutonium is exceptionally high for a metal, whereas those of 5- and 5 -plutonium are negative. The net linear increase in heating a polycrystalline rod of plutonium from room temperature to just below the melting point is 5.5%. 

A summary of physical and chemical constants for beryUium is compUed ia Table 1 (3—7). One of the more important characteristics of beryUium is its pronounced anisotropy resulting from the close-packed hexagonal crystal stmcture. This factor must be considered for any property that is known or suspected to be stmcture sensitive. As an example, the thermal expansion coefficient at 273 K of siagle-crystal beryUium was measured (8) as 10.6 x 10 paraUel to the i -axis and 7.7 x 10 paraUel to the i -axis. The actual expansion of polycrystalline metal then becomes a function of the degree of preferred orientation present and the direction of measurement ia wrought beryUium. 

---