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Thermal conductivity solder replacement adhesives

Adhesives used for screen or stencil printing in surface-mount applications are generally electrically insulative types whose functions are mechanical attachment and thermal dissipation. However, electrically conductive, silver-filled epoxies have been used for many years as ohmic contact adhesives to interconnect bare-chip devices in hybrid microcircuits and are used as solder replacements for surface mounting of components on printed-circuit boards. Regardless of their... [Pg.178]

The adhesive has minimal function after the soldering application, but it must not reduce the reliability of the circuit by becoming conductive during environmental exposure, or put stress on the components during thermal cycling or mechanical handling. On the other hand, if component replacement is necessary, the adhesive should soften sufficiently at soldering iron temperature to allow part removal. [Pg.702]


See other pages where Thermal conductivity solder replacement adhesives is mentioned: [Pg.31]    [Pg.32]    [Pg.871]    [Pg.217]    [Pg.217]    [Pg.433]    [Pg.144]    [Pg.163]    [Pg.163]    [Pg.163]    [Pg.26]   


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