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TGMDA/DDS resins

Fractions of the higher molecular weight, more complex reaction products were obtained by the preparative SEC of further advanced TGMDA/DDS reaction mixtures. For example, the proposed components of the next highest oligomer fraction are the 3-1, 2-2, and 1-3 TGMDA-DDS products. The relative ratio of the products depends upon the initial composition of the TGMDA/DDS resin formulation. [Pg.339]

The isothermal cure kinetics of a series of TGMDA/DDS resin formulations were investigated over the temperature range 121°-187°C. Figure 4 illustrates data obtained for the resin TGMDA/DDS(25%) at 177°C. During the early stage of cure prior to the onset of... [Pg.341]

The rate of change and values of the MW parameters provide information relating to the formation of the gel network. MW parameters for the TGMDA/DDS(25%) resin are plotted versus reaction time at 177°C (Figure 10). M, and M are most sensitive to the... [Pg.350]

Figure 9, Arrhenius plot of the reaction time to the onset of gelation t for the TGMDA/DDS (.25 ) resin. Figure 9, Arrhenius plot of the reaction time to the onset of gelation t for the TGMDA/DDS (.25 ) resin.
An egulvalence between the exotherms for the epoxy-amine addition and the epoxy-epoxy polymerization reaction simplifies the interpretation of data and permits the direct comparison of TGMDA resins having gulte different compositions. For TGMDA/DDS reactions, increasing the epoxy/amine eguivalent ratio -... [Pg.46]

Pascal, X, Bonneau, J. L., Biolley, N., Mercier, N., and Sillion, B., Approach to improving the toughness of TGMDA/DDS epoxy resin by blending with thermoplastic polymer powder, Polym. Adv. Technol., 6, 219, 1995. [Pg.456]

The effects of impurities, or synthesis byproducts, and stoichiometry on the cure kinetics of N,N -tetraglycldyl methylene dianiline (TGMDA) resins formulated with dlaminodiphenyl sulfone (DDS) are evaluated using gel permeation chromatography and differential scanning calorimetry. [Pg.25]

DSC Study. From the analysis of the total heats of reaction of the commercial and fractionated TGMDA resin/DDS formulations over a broad stoichiometric range, it is concluded that the total heat of reaction divided by the epoxy concentration has a constant value... [Pg.37]

Results obtained by the GPC and DSC studies are in excellent agreement. Correlations between GPC and DSC data provide a better understanding of epoxy resin cure behavior and are useful In assessing the effects of stoichiometry and impurities. Simple amine-to-epoxy addition is the predominant reaction between TGMDA and DDS during the early stages of cure. This reaction is adeguately described by a third-order rate expression (Eg. 10). [Pg.46]

See other pages where TGMDA/DDS resins is mentioned: [Pg.333]    [Pg.334]    [Pg.344]    [Pg.354]    [Pg.188]    [Pg.107]    [Pg.4]    [Pg.26]    [Pg.333]    [Pg.334]    [Pg.344]    [Pg.354]    [Pg.188]    [Pg.107]    [Pg.4]    [Pg.26]    [Pg.21]    [Pg.335]    [Pg.337]    [Pg.338]    [Pg.339]    [Pg.344]    [Pg.350]    [Pg.354]    [Pg.170]    [Pg.25]    [Pg.32]    [Pg.33]    [Pg.40]    [Pg.574]    [Pg.574]    [Pg.253]    [Pg.333]    [Pg.334]    [Pg.334]    [Pg.183]    [Pg.103]    [Pg.26]    [Pg.44]    [Pg.46]    [Pg.6]    [Pg.562]    [Pg.194]    [Pg.206]    [Pg.135]    [Pg.442]   


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DDS

TGMDA resins

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