Tetrafluoroethylene filled resins

Fluorinated ethylene-propylene resin Poly(vinylidene fluoride) Ethylene-tetrafluoroethylene copolymer Ethylene- chlorotrifluoro- ethylene copolymer Cellulose- filled Glass-fiber- reinforced... [Pg.1036]

Polymeric substrate materials in use include highly filled phenolic and epoxy resins for rigid printed circuit boards, polyimides and polyesters for circuit substrates as well as for more general applications, special foamed poly(tetrafluoroethylene) polymers and copolymers, foamed composite materials of the latter, special epoxy fiberglass composites, and polyimide support layers for TAB. In addition, epoxies and silicone polymers are used increasingly in applications as encapsulants, as humidity and environmental barriers within packages, and as packaging materials themselves. [Pg.12]

Epoxy and filled epoxy Silicones and filled silicones Bis-maleimide triazine (BT) resin BT-Epoxy E-glass laminate Epoxy-E-glass laminate Polyimide-E-glass laminate Poly(tetrafluoroethylene)-E-glass laminate Polyimide-E-glass laminate Polyester film Polyimide film... [Pg.2489]