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Surface finishes Organic Solderability Preservative

The substrate surfaces of choice are usually one of the following electroless nickel/immersion gold (ENIG), immersion silver (ImAg), and organic solderability preservative (OSP). Two other finishes, hot air solder leveling (HASL) and immersion tin, are also in use, but HASL has declined in volume and immersion tin has not reached significant volumes due to concerns over reliability. [Pg.1016]

OSP Organic solder preservatives are inexpensive and also provide a flat surface for surface-mount technology (SMT) placement. Storage life for OSP is less than for the metallized finishes, and multiple thermal cycles cause it to degrade. [Pg.1016]

No-clean solder pastes can solder most popular metal finishes adequately due to improvements in the activator packages. Gold over nickel, bare copper with organic surface preservatives, silver immersion, tin plates, and hot-air leveled boards are popular, while component terminations such as tin, tin/lead, silver, silver palladium, and nickel are used. Solder pastes can be designed to solder specific surfaces and maintain the non-corrosive and electrical resistance required to qualify them as no-clean pastes. [Pg.15]

See other pages where Surface finishes Organic Solderability Preservative is mentioned: [Pg.302]    [Pg.304]    [Pg.5]    [Pg.83]    [Pg.442]    [Pg.469]    [Pg.700]    [Pg.241]    [Pg.66]    [Pg.752]    [Pg.758]   
See also in sourсe #XX -- [ Pg.10 , Pg.12 , Pg.32 , Pg.45 ]



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Surface finish

Surface-finishing

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