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Stress-strain at ambient conditions

Figure 6. Engineering stress-strain at ambient conditions of 303-0, 303-50 and of the sulfur vulcanized EPDM backbone. ASTM die C samples were stretched at 20 in./min. Figure 6. Engineering stress-strain at ambient conditions of 303-0, 303-50 and of the sulfur vulcanized EPDM backbone. ASTM die C samples were stretched at 20 in./min.
Figure 7. Engineering stress-strain at ambient conditions of Zn-S-EPDM samples with various loading levels of zinc stearate (see text for sample size). Figure 7. Engineering stress-strain at ambient conditions of Zn-S-EPDM samples with various loading levels of zinc stearate (see text for sample size).
Figure 7. Stress-strain curves of strips cut from an as-fabricated MEA with N-112 membrane the test was conducted at ambient conditions. Figure 7. Stress-strain curves of strips cut from an as-fabricated MEA with N-112 membrane the test was conducted at ambient conditions.
Figure II. Stress-strain behaviors at ambient conditions, (a) DSF composites (b) SPI composites (c) SPC composites (d) CB composites. Wt% of filler is indicated on each curve. The samples were prepared by the casting method. (Reproduced from reference 16.)... [Pg.99]

Al-Mg (5000 Series) and Al-Mg-Si (6000 Series) In the binary alloy system strength is obtained mainly by strain hardening. Stress corrosion is thought to be associated with a continuous grain boundary film of Mg,Alg which is anodic to the matrix . Air cooling prevents the immediate formation of such precipitates, but they form slowly at ambient temperatures. Thus only low Mg alloys are non-susceptible (Al-3% Mg). Widespread precipitation arising from plastic deformation with carefully controlled heat-treatment conditions can lower susceptibility. Al-5Mg alloys of relatively low susceptibility are subjected to such treatments. Mn and Cr... [Pg.1275]

In assessing the relative role of these factors under varying ambient conditions (e.g., the presence or absence of aggressive anions such as Cl ), recall that all metals have a degree of strain (e.g., fraction elongated) at which they will lose the ability to resume their original structure when the stress is released. Nonelas-... [Pg.269]

The SME of this nanocomposite fiber was investigated by heating the fiber to 70°C, and stretching it to 100% strain at a speed of 10mm min . The fiber was cooled to ambient temperature (22°C) while keeping the applied stress. After unloading, the fiber was heated to 70°C under stress-free condition to recover its original permanent shape. This cycle was repeated four times for each fiber. The Rf N) and Ri N) at the Ath cycle as well as the total recovery ratio / rtot(/V) after Ath cycle were calculated and are listed in Table 2. [Pg.76]

The close relation between the composition and the mechanical properties of these polymers is reflected in the stress-strain diagrams measured at 300 K and 348 K (Figs. 47 and 48). Hence, at ambient temperature for the spedfied experimental conditions a distinct increase of initial modulus (11. 45 and 1 MNm ), stress-hysteresis (ratio of area bounded by a strain cycle to the total area underneath the elongation curve 60,80 and 90 %) and extension set (30,65 and 100 %) can be obsened with increasing hard segment content of polyester urethane (a) to (c). [Pg.60]

The oxide surface may provide a lower bound of the diameter of a whisker hence, we do not expect to find nano-diameter Sn whiskers. The growth rate or stress relief rate may provide an upper bound of the diameter hence, we do not expect to find Sn whiskers as large as our hair with a diameter of approximately 100 pm. A whisker with a larger diameter may gain in volume to surface ratio, but it will grow slower due to a slower rate of vacancy supply from the circumference at the root of the whisker, and in turn, a slower strain relief rate. For this reason, the ambient condition, in which the partial pressure of oxygen and the content of moisture that affect the oxidation rate, may also affect the whisker growth rate and whisker diameter. [Pg.156]

To and Fq are the references at the ambient conditions. Ay is the energy perturbation and 8y the strain caused by the applied stimuli. The summation and the production are preceded over all the J stimuli of (z, s, P, T). The a(f) is the temperature-dependent thermal expansion coefficient (TEC), p = —dv/ vdp) is the compressibility (p <0 compressive stress) or extensibility (p > 0 tensile stress) that is proportional to the inverse of elastic bulk modulus. The k(s) is the effective force constant. rj(t) is the T-dependent specific heat of the representative bond, which approximates Debye approximation, C iTIdi)), for a z-coordinated atom. Generally, the thermal measurement is conducted under constant pressure and the i/(f) is related to the Cp. However, there is only a few percent difference between the Cp and Cy [1]. [Pg.458]


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