Stress analysis adhesion

Daghyani. H.R.. Ye. L. and Mai. Y.W. (1995b). Mode I fracture behaviour of adhesive joints, 2, Stress analysis of constraint parameters. J. Adhesion 53, 163-172. 

In spite of the imperfections of the approach, the reversible work of adhesion can be used for the characterization of matrix/filler interactions in particulate filled polymers. Debonding is one of the dominating micromechanical processes in these materials. Stress analysis has shown that debonding stress (a ) depends on the reversible work of adhesion [8], i.e. ... 

Recently, stress analysis has been carried out for the determination of stress distribution around inclusions in particulate filled composites. A model based on the energy analysis has led to the determination of debonding stress [8]. This stress, which is necessary for the separation of the matrix and filler, was shown to depend on the reversible work of adhesion (see Eq. 16) and it is closely related to parameter B. 

At one time the stress analysis required for the use of fracture mechanics would have posed a formidable problem for many practical applications. This situation is becoming progressively less of a problem as more sophisticated and better numerical methods for stress analysis become available (30). For example, the use of finite element techniques in the fracture mechanics analysis of adhesive bonds has been explored (31). 

Flexural modulus is a measure of the strength of adhesives. Modulus data are most often used in stress analysis (one-dimensional or as an input to 3-D modeling). In addition to flexural modulus, elongation-at-break is also recorded. The standard test... 

Photoelastic stress analysis is a powerful full-field technique where a product part is first covered with a thin film of special, transparent plastic. The layer must be bonded on with a reflective adhesive. The part is then deformed under static conditions and illuminated with polarized light. Viewing the part with a special polarizing optic system... 

Nearly a century after Fairbaim, in 1938, two ideas emerged from the new engineering of airframes which were to focus on the paradoxical notion embodied in Equations (15.1) and (15.2). Volkersen derived a stress analysis for the deformation of a lap joint, showing that infinite stresses could arise at the ends of a lap joint, and Chadwick measured the peel strength of soldered joints, raising the conundrum that a joint is much weaker in peeling than it is when overlapped. How can strength be different when the same adhesive is employed ... 

The science of adhesion is truly multi-disciplinary, demanding a consideration of concepts from such topics as surface chemistry, polymer chemistry, rheology, stress analysis and fracture mechanics. It is, nevertheless, important for the technologist to possess a qualitatively correct overall picture of the various factors influencing adhesion and controlling joint performance in order to make rational judgements concerning the selection and use of adhesives. 

Lunsford, L.R., Stress analysis of bonded joints. Applied Polymer Symposia No. 3, Structural Adhesive Bonding, Presented at a Symposium Sponsored by Picatinny Arsenal and held at Stevens Institute of Technology, September 14-16, 1965, pp. 57-73, Wiley-Interscience, New Yoik, 1966. 

The finite element (FE) technique is an approximate numerical method for solving differential equations. Within the field of adhesive technology, it is most commonly used to determine the state of stress and strain within a bonded joint. It can also be used to determine moisture diffusion, natural frequencies of vibration and other field problems. Although this article will concentrate on the stress analysis, the same concepts can be applied to these other applications of finite element analysis. The basis of any finite element method is the discretization of the (irregular) region of interest into a number of... 

R. B. Kreiger, Stress analysis concepts for adhesive bonding of aircraft primary stmcture. Structural Adhesives in Engineering, Proc IMechE, Bristol, 1986. 

The stress analysis of bonded joints remains in its infancy and, until it is better developed, simple shear strength values such as those given in Figure 2.16 (and typically provided by most manufacturers) should not be used alone to assess the ability of an adhesive to transmit power (see pp.l6 22 Supplementary role of adhesives in power transmission). 

Sawa, T., Yoneno, M., Motegi, Y. (2001). Stress analysis and strength evaluation of bonded shrink fitted joints subjected to torsional loads. Journal of Adhesion Science and Technology, 15(1), 23-42. 

Many researchers have performed subsequent analysis of lap shear joints.Plantema combined the results of Volkersen and Goland and Reissner and also included shear effects.Cornell analyzed the lap shear joint and characterized the adherends as simple beams while considering the adhesive to behave as a system of shear and tension springs.The stress analysis of an unusual lap joint consisting of circular tubes was studied by Lubkin and Reissner. Lubkin was able to define conditions for uniform stress distributions in both flat and tubular lap joints, specifically when the adhesive is perfectly elastic. ... 

So far all of the analyses discussed or mentioned have assumed linear elasticity of the joint. However, adhesives typically show either plastic or elastic-plastic behavior, depending on the nature of the joint materials. Several investigators have included the nonlinear or time-dependent behavior of the adhesive joint in the stress analysis of single-lap joints. 

As described in Section II of this chapter, there are many types of peel tests available to characterize adhesives. These tests are important because peel stresses arise in the loading of many joint geometries, such as lap joints. Peel tests are severe because they constitute a test of the adhesive in its weakest stress mode. However, the peel test is a comparative test for adhesives and is dependent on many parameters. These parameters, such as peel speed, peel angle, bond thickness, and temperature, must be held constant to obtain valid results. The stress analysis of peeling is highly complicated because of these variable dependencies. 

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