Sputtering of metals

Low pressure argon is the usual medium for industrial sputtering of metals and other soHd films (100) (see Thin films, film formation techniques). 

The introduction of metals into plasma polymers has been the subject of some research during recent years. Basically, three methods have been used (a) Plasma polymerization of organometallic compounds [79,80], (b) Concomitant etching or sputtering of metals [81] and (c) Evaporation of metals into a [82] plasma polymerization system. Munro et aL [83, 84] incorporated mercury into... 

DC sputtering Metals, some semiconductors some insulators (reactive sputtering) Vacuum, works best with conductors, better than vapor evaporation for high-melting species, better adhesion than vapor evaporation, but rougher surface reactive sputtering of metals in presence of oxygen or other reactive gas can deposit some insulators... 

Among the possibilities are the effect of the weather and atmospheric pollution on the properties of the exposed surfaces of components. They will become roughened and will adsorb increasing amounts of moisture and conductive impurities. Surface discharges may occur which will result in further deterioration due to local high temperatures and the sputtering of metallic impurities from attached conductors. 

Reaction During the Sputtering of Metals onto Polyimide... 

The sputtering of metal from the electrode by Ar glow discharge depends primarily on the kinetic energy of the impinging ions. Therefore, it is easy to... 

Because polymer formation and ablation are competitive and opposing processes, polymer-forming plasma has the least ablative effect however, ablation in such plasmas cannot be completely ruled out. Sputtering of metals used as the internal electrodes for plasma polymerization has been recognized as a contamination of plasma polymers. Under certain conditions, the sputtering of the electrode materials becomes significant and plays an important role in the engineering of interface as described in Chapter 9. 

In contrast to argon plasma, in which the sputtering of metal from the electrode is the primary process, the deposition of polymeric materials via plasma polymerization predominantly takes place in methane plasma. In such a polymer-forming plasma, the sputter deposition of electrode materials is considered as a secondary process, and the extent of the sputtering of metal depends on the plasma polymerization conditions, the nature of the electrode material, and the magnetic field strength. 

R. Kukla, M. B8hr, S. Beisswenger, W.E. Fritsche, M. Liibbehusen High Rate Sputtering of Metals and Metal Oxides with a Moving Plasma Zone, Thin Solid Filins,... 

The total target sputtering flux, ineluding sputtering of metal and compound, related to the ion bombardment flux can be expressed in this case as... 

It took us 10 years to develop the technology for such a measurement. Singly charged ions of germanium were produced by xenon sputtering of metallic germanium in the CHORDIS ion source, whereas for selenium the ion-source oven was loaded with metallic selenium. An isotopically pure beam was achieved us-... 

Sputtering of metals (e.g., gold) onto tissue sections before/after the matrix application process improves the spectrum quality [63,72]. 

---