Sputtering definition

Injection molding requires the barrel temperature to be about 350°C with a barrel pressure in excess of 138 MPa. The mold is maintained at 110°C to ensure uniform flow and high definition, and to discourage an uneven index of refraction, birefringence. The CD is about four one-hundredths of an inch (0.5 mm) thick. For prerecorded CDs, the PC is compression-molded on a stamper imprinted with the recorder information. This takes about 4 sec. Once the clear piece of polycarbonate is formed, a thin, reflective aluminum layer is sputtered onto the disc. Then, a thin acrylic layer is sprayed over the aluminum to protect it. The label is then printed onto the acrylic surface and the CD is complete. This process is described later in greater detail. 

Fig. 5.6. Reactive sputter process for depositing the compound film AB. (a) Balance of reactive gas flow Qtot, which is partially gettered at the target (Qt) and at the substrate (Qc) and partially pumped by the vacuum pump (Qp). The fraction of the target surface At that is covered by the compound AB is 6>t. The fraction of the collecting area Ac covered is Gc. j is the sputter current density, (b) Definition of particle fluxes that alter the target and collecting area coverage fractions 6>t and 6>c (see text), (modified from [70])...

Based on this definition by Winters and Coburn [81] we propose the following mechanism for the chemical sputtering of a-C H (i) The incident ions... 

Glasses can also be prepared by methods other than cooling from a liquid state, including solution evaporation, reactive sputtering, vapor deposition, neutron bombardment, and shock wave vitrification . These techniques suggest that the purely kinetic explanation of the glassy state is subject to question, and that the previous definitions need to be modified. One proposal would define glasses based on isotropy and relaxation time measurements . 

Whilst the above definition introduces the basic high level understanding and observations of the process, a more concise and scientific definition for CVD is a process whereby a thin solid film is deposited onto a substrate through chemical reactions of the gaseous species. For structural component applications, the deposition typically takes place at a temperature of around 1000°C. It is the reactive processes that distinguish CVD process from physical vapour deposition (PVD) processes, such as physical evaporation process, sputtering and sublimation processes [1],... 

The back side of the wafer is metallized with 1 pm of aluminum deposited by RF sputtering. This layer will be used as a mask material for the DRIE definition of the cavities. 

It is more convenient, especially in the surface analysis field, to define preferential sputtering using the surface versus the bulk composition. At steady state an ion beam simply moves the atoms of a solid from one place to another. The composition of the sputtered flux must be equal to the bulk composition at steady state. From the definition of the sputter yield, the surface concentration can be related to the bulk... 

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